AMD Xilinx
XC5215-3HQ240I
XC5215-3HQ240I ECAD Model
XC5215-3HQ240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | TYP. GATES = 15000-23000 | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HEAT SINK, PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-3HQ240I Datasheet Download
XC5215-3HQ240I Overview
The XC5215-3HQ240I is a powerful chip model that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language to program the chip and is designed to be compatible with industry-standard development tools.
The XC5215-3HQ240I is designed to be flexible and can be used in many different types of applications. Its features include a high-speed processing unit, a high-performance memory controller, and a wide variety of peripherals. It is also designed to be energy efficient and has a low power consumption.
The XC5215-3HQ240I is a versatile chip model that can be used in a variety of industries. It can be used in automotive, industrial, medical, and consumer electronics applications. It can also be used in industrial control, robotics, and communications applications. The chip model is also suitable for sensor and monitoring applications.
The XC5215-3HQ240I is designed to be compatible with industry-standard development tools and can be programmed using HDL language. It also supports a wide range of peripherals and can be used in a variety of applications. The chip model is also designed to be energy efficient and has a low power consumption.
The product description and specific design requirements of the chip model XC5215-3HQ240I, along with actual case studies and precautions, can be found in the chip model's documentation. This documentation provides detailed information on how to use the chip model and what features are available. It also provides information on the development environment and provides guidelines on how to design and program the chip model.
The industry trends of the chip model XC5215-3HQ240I and the future development of related industries depend on what specific technologies are needed for the application environment. Technologies such as artificial intelligence, virtual reality, and machine learning are becoming increasingly important and are being used in many industries. These technologies are being used to improve the performance of the chip model and to create new applications.
In conclusion, the XC5215-3HQ240I is a powerful chip model that is suitable for a wide range of applications. It is designed to be compatible with industry-standard development tools and can be programmed using HDL language. The product description and specific design requirements of the chip model, along with actual case studies and precautions, can be found in the chip model's documentation. The industry trends of the chip model and the future development of related industries depend on what specific technologies are needed for the application environment.
You May Also Be Interested In
5,656 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||