AMD Xilinx
XC5215-3HQ208C
XC5215-3HQ208C ECAD Model
XC5215-3HQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5215-3HQ208C Datasheet Download
XC5215-3HQ208C Overview
The XC5215-3HQ208C chip model is the latest in a series of powerful chips that have been developed by the tech giant XC Technologies. This chip model is designed to provide a powerful and efficient solution for a variety of industries and applications. It is a low-power, high-performance chip that is capable of handling complex tasks with ease.
The XC5215-3HQ208C chip model is designed to provide a high level of performance, while also being energy efficient. It is designed to be used in a variety of applications, such as wireless networks, industrial automation, and other embedded systems. The chip model is capable of handling a wide range of tasks, including data processing, image processing, and other complex tasks.
The XC5215-3HQ208C chip model has several advantages that make it attractive to industries. It has a low power consumption, which makes it an ideal choice for many applications. It also has a high performance level, which makes it suitable for a variety of tasks. Additionally, the chip model is designed to be easily upgradable, which makes it possible to use the chip in more advanced applications in the future.
The XC5215-3HQ208C chip model is expected to be in high demand in the future, as it is capable of handling complex tasks with ease. It is also expected to be used in a variety of applications, such as wireless networks, industrial automation, and other embedded systems. Additionally, the chip model is expected to be used in the era of fully intelligent systems, as it is capable of handling a wide range of tasks. It is also expected to be used in networks and other intelligent scenarios, as it is capable of handling complex tasks with ease.
Overall, the XC5215-3HQ208C chip model is a powerful and efficient solution for a variety of industries and applications. It is designed to provide a high level of performance, while also being energy efficient. Additionally, the chip model is designed to be easily upgradable, which makes it possible to use the chip in more advanced applications in the future. It is expected to be in high demand in the future, as it is capable of handling complex tasks with ease. It is also expected to be used in a variety of applications, such as wireless networks, industrial automation, and other embedded systems. Additionally, the chip model is expected to be used in the era of fully intelligent systems, as it is capable of handling a wide range of tasks. It is also expected to be used in networks and other intelligent scenarios, as it is capable of handling complex tasks with ease.
You May Also Be Interested In
2,088 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $26.6943 | $26.6943 |
| 10+ | $26.4073 | $264.0731 |
| 100+ | $24.9721 | $2,497.2132 |
| 1000+ | $23.5370 | $11,768.4760 |
| 10000+ | $21.5277 | $21,527.7000 |
| The price is for reference only, please refer to the actual quotation! | ||