AMD Xilinx
XC5215-3BG352C
XC5215-3BG352C ECAD Model
XC5215-3BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-3BG352C Datasheet Download
XC5215-3BG352C Overview
Chip model XC5215-3BG352C is a breakthrough in the semiconductor industry, offering a variety of advantages over traditional chip models. It features a wide range of features, including a high-performance processor, high-speed memory, and advanced security capabilities. This chip model is designed to meet the needs of the most demanding applications, offering the highest level of performance and reliability.
The XC5215-3BG352C chip model is expected to become increasingly popular in the coming years due to its unique features and advantages. This chip model is ideal for applications related to industrial automation, robotics, medical, and automotive industries, where high-performance processing and reliable operation are essential. It is also expected to be used in consumer applications, such as home automation and entertainment systems.
The XC5215-3BG352C chip model is designed to meet the most stringent requirements of its intended applications. It features a powerful processor and high-speed memory, allowing for fast and reliable operation. Additionally, it has advanced security features, such as secure boot and encryption, to prevent malicious attacks. Furthermore, it is designed to be compatible with a wide range of external devices, such as sensors, cameras, and other peripherals.
The XC5215-3BG352C chip model is expected to be used in a variety of intelligent scenarios, such as autonomous driving and robotics. It is also expected to be used in networks and other smart systems, such as home automation systems and smart cities. The chip model is also expected to be used in the era of fully intelligent systems, such as the Internet of Things (IoT).
The XC5215-3BG352C chip model is a powerful and reliable device that is designed to meet the most demanding requirements. It is expected to be used in a variety of applications, from industrial automation to consumer applications. It is also expected to be used in networks and intelligent scenarios, such as autonomous driving and robotics. Furthermore, it is designed to be compatible with a wide range of external devices, such as sensors, cameras, and other peripherals.
In order to ensure the proper functioning of the XC5215-3BG352C chip model, it is important to follow the manufacturer's instructions and adhere to the specific design requirements. Additionally, it is important to consider the actual case studies and potential issues when using the chip model. Furthermore, it is important to ensure that the chip model is properly installed and maintained, in order to ensure its optimal performance and reliability.
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|---|---|---|
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