AMD Xilinx
XC5215-3BG225C
XC5215-3BG225C ECAD Model
XC5215-3BG225C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 244 | |
| Number of Outputs | 244 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 15000 GATES | |
| Additional Feature | MAX AVAILABLE 23000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA225,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5215-3BG225C Datasheet Download
XC5215-3BG225C Overview
XC5215-3BG225C is a powerful and highly advanced chip model that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. This model is designed to be used with the HDL language, which is a hardware description language that is used to create electronic systems.
The XC5215-3BG225C chip model features a high-performance processor with a wide range of features. It is designed to provide users with an efficient and reliable way to process data and execute instructions. This chip model also includes an on-chip memory and a wide range of peripherals. It is capable of supporting a variety of applications, including digital signal processing, embedded processing, and image processing.
Product descriptions of the XC5215-3BG225C chip model provide detailed information about the features and capabilities of the model. Detailed design requirements and case studies are also available to help users understand the model and its features. Furthermore, the model includes a wide range of safety and security features to ensure that the data is secure and that the system is reliable.
The XC5215-3BG225C chip model can be used in the development and popularization of future intelligent robots. This model is capable of providing the necessary power and features to enable robots to process data and make decisions quickly and accurately. To use the model effectively, it is important to have a good understanding of the HDL language and the features and capabilities of the model. Additionally, knowledge of robotics and machine learning is also beneficial in order to use the model effectively.
Overall, the XC5215-3BG225C chip model is a powerful and highly advanced chip model that is suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. With the right knowledge and skills, this model can be used in the development and popularization of future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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