AMD Xilinx
XC5210-6TQG144I
XC5210-6TQG144I ECAD Model
XC5210-6TQG144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-6TQG144I Datasheet Download
XC5210-6TQG144I Overview
The chip model XC5210-6TQG144I has been gaining popularity in the industry due to its impressive features and performance. It is a low-power, high-performance, and highly integrated chip model that can be used in a wide range of applications. It is suitable for a variety of applications such as network communications, wireless communications, and embedded systems.
The XC5210-6TQG144I chip model has a wide range of features, including a high-performance processor, a variety of peripherals, and a low-power design. It is also equipped with a variety of security features, making it an ideal choice for applications that require high levels of security. It also supports a variety of communication protocols, allowing it to be used in a wide range of applications.
In terms of industry trends, the XC5210-6TQG144I chip model is expected to be increasingly in demand in the future as the need for high-performance and low-power devices increases. It is likely to be used in a variety of applications, including networks, wireless communications, and embedded systems. This chip model is also expected to be used in intelligent scenarios, such as the Internet of Things (IoT), autonomous vehicles, and smart homes.
In terms of future applications, the XC5210-6TQG144I chip model is expected to be used in a variety of networks, including 5G, Wi-Fi 6, and Bluetooth. It is also expected to be used in intelligent scenarios, such as autonomous vehicles, smart homes, and the Internet of Things (IoT). The chip model is also expected to be used in the era of fully intelligent systems, as it supports a variety of communication protocols and is equipped with a variety of security features.
Overall, the XC5210-6TQG144I chip model is an impressive chip model that is expected to be increasingly in demand in the future. It is suitable for a variety of applications and is expected to be used in a variety of networks and intelligent scenarios. It is also expected to be used in the era of fully intelligent systems, as it supports a variety of communication protocols and is equipped with a variety of security features.
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2,673 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $34.6103 | $34.6103 |
| 10+ | $34.2382 | $342.3817 |
| 100+ | $32.3774 | $3,237.7398 |
| 1000+ | $30.5166 | $15,258.3140 |
| 10000+ | $27.9116 | $27,911.5500 |
| The price is for reference only, please refer to the actual quotation! | ||