
AMD Xilinx
XC5210-6TQG144C
XC5210-6TQG144C ECAD Model
XC5210-6TQG144C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 324 | |
Combinatorial Delay of a CLB-Max | 5.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 324 CLBS, 10000 GATES | |
Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC5210-6TQG144C Datasheet Download
XC5210-6TQG144C Overview
The XC5210-6TQG144C chip model is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It is designed with HDL language and can be used in various application scenarios. With the rapid development of technology, the chip model XC5210-6TQG144C will be applied to more advanced communication systems in the future.
The original design intention of the chip model XC5210-6TQG144C is to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing. The chip model is designed with a series of advanced features, such as highly integrated hardware, low power consumption, and high performance. It is also designed to be compatible with different operating systems, enabling it to be used in different application scenarios.
The chip model XC5210-6TQG144C has a wide range of applications, and it is suitable for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is also suitable for various communication systems, such as wireless communication, cellular communication, and satellite communication. In addition, it can also be used in industrial automation, medical devices, and consumer electronics.
The industry trends of the chip model XC5210-6TQG144C are mainly driven by the development of new technologies, such as 5G and artificial intelligence. With the development of these technologies, the chip model XC5210-6TQG144C will be able to support more advanced communication systems and applications. In addition, the chip model can be upgraded to support the latest technologies, such as high-speed data transfer and high-performance computing.
In conclusion, the chip model XC5210-6TQG144C is a powerful and efficient solution for digital signal processing, embedded processing, image processing, and other related applications. It is designed with advanced features and is suitable for various communication systems. With the development of new technologies, the chip model can be upgraded to support more advanced communication systems and applications.
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3,464 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $34.6103 | $34.6103 |
10+ | $34.2382 | $342.3817 |
100+ | $32.3774 | $3,237.7398 |
1000+ | $30.5166 | $15,258.3140 |
10000+ | $27.9116 | $27,911.5500 |
The price is for reference only, please refer to the actual quotation! |