AMD Xilinx
XC5210-6PQG240I
XC5210-6PQG240I ECAD Model
XC5210-6PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-6PQG240I Datasheet Download
XC5210-6PQG240I Overview
The XC5210-6PQG240I chip model is the latest innovation from the semiconductor industry, designed to provide advanced performance and reliability for a variety of applications. This chip model is designed to offer a range of advantages and features, making it a valuable asset to any business or organization.
The XC5210-6PQG240I chip model is designed with a variety of features that make it an ideal choice for a range of applications. It is capable of handling high-speed data transfers, making it ideal for networking, communications, and other applications that require high-speed data transfer. Additionally, the chip model is designed with advanced power management capabilities, allowing it to reduce power consumption while still maintaining performance. The chip model also features a low-power state mode, allowing it to conserve power when not in use.
The XC5210-6PQG240I chip model is expected to be in high demand in the coming years due to its advanced features and capabilities. As businesses and organizations continue to demand more powerful and reliable solutions, the XC5210-6PQG240I chip model is expected to be a key component of many advanced solutions. Additionally, the chip model is likely to be used in a variety of intelligent scenarios, such as artificial intelligence, machine learning, and autonomous vehicles.
The original design intention of the XC5210-6PQG240I chip model was to provide a reliable and powerful solution for a variety of applications. It is designed to offer a range of advantages, including high-speed data transfer, low power consumption, and advanced power management capabilities. Additionally, the chip model is designed with the possibility of future upgrades, allowing it to stay up-to-date with the latest advancements in technology.
The XC5210-6PQG240I chip model is expected to be used in a variety of applications in the future, including networking, communications, and other intelligent scenarios. It is likely to be used in the era of fully intelligent systems, providing reliable and powerful solutions for businesses and organizations. Additionally, the chip model is expected to be used in networks, allowing for high-speed data transfer and improved performance. The chip model is also likely to be used in intelligent scenarios, such as artificial intelligence, machine learning, and autonomous vehicles.
The XC5210-6PQG240I chip model is an advanced solution that is designed to provide reliable and powerful performance for a variety of applications. It is expected to be in high demand in the coming years due to its advanced features and capabilities. Additionally, the chip model is designed with the possibility of future upgrades, allowing it to stay up-to-date with the latest advancements in technology. The chip model is expected to be used in a variety of applications in the future, including networking, communications, and other intelligent scenarios. It is likely to be used in the era of fully intelligent systems, providing reliable and powerful solutions for businesses and organizations.
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5,576 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $50.4137 | $50.4137 |
| 10+ | $49.8716 | $498.7164 |
| 100+ | $47.1612 | $4,716.1221 |
| 1000+ | $44.4508 | $22,225.4030 |
| 10000+ | $40.6562 | $40,656.2250 |
| The price is for reference only, please refer to the actual quotation! | ||