
AMD Xilinx
XC5210-6PQG160I
XC5210-6PQG160I ECAD Model
XC5210-6PQG160I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 324 | |
Combinatorial Delay of a CLB-Max | 5.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 324 CLBS, 10000 GATES | |
Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC5210-6PQG160I Datasheet Download
XC5210-6PQG160I Overview
The XC5210-6PQG160I is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is equipped with a high-speed processor, a large amount of memory, and a wide range of peripherals, making it an ideal choice for advanced communication systems. The original design intention of the XC5210-6PQG160I is to provide users with a powerful and flexible platform for a variety of applications.
The XC5210-6PQG160I is based on a 32-bit RISC core architecture, and is capable of executing instructions at a clock speed of up to 160MHz. It is also equipped with a large amount of on-chip SRAM and Flash memory, as well as a wide range of peripherals, including a USB 2.0 host port, Ethernet MAC, and an I2C bus. The XC5210-6PQG160I is designed to be highly configurable, allowing users to tailor the chip to their specific requirements.
The XC5210-6PQG160I is programmed using the HDL (Hardware Description Language) language. This language allows users to easily create complex digital designs and to quickly test and debug them. The XC5210-6PQG160I is also designed to be easily upgradable, allowing users to add new features and functionality to their designs.
In order to ensure optimal performance, it is important to follow the design guidelines provided by the manufacturer. This includes ensuring that all components are properly connected, that all power supplies are stable, and that the chip is properly cooled. Additionally, it is important to take into account the specific requirements of each application, as this will have an impact on the overall performance of the XC5210-6PQG160I.
To illustrate the potential of the XC5210-6PQG160I, a number of case studies have been conducted. These case studies demonstrate the chip's ability to handle complex tasks, such as image processing, data compression, and encryption. Additionally, the XC5210-6PQG160I has been used in a variety of embedded systems, including industrial control systems, automotive systems, and medical devices.
In conclusion, the XC5210-6PQG160I is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be highly configurable and upgradable, and is programmed using the HDL language. In order to ensure optimal performance, it is important to follow the design guidelines provided by the manufacturer, and to take into account the specific requirements of each application. Finally, a number of case studies have been conducted to demonstrate the chip's potential.
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