AMD Xilinx
XC5210-6BG225I
XC5210-6BG225I ECAD Model
XC5210-6BG225I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA225,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-6BG225I Datasheet Download
XC5210-6BG225I Overview
The XC5210-6BG225I chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) programming language, allowing users to quickly and easily create and develop powerful applications.
The XC5210-6BG225I chip model has several advantages that make it an ideal choice for many applications. It offers high-speed performance, low power consumption, and a wide range of features. It is also highly scalable, allowing users to easily upgrade the processor to meet their needs. Additionally, the XC5210-6BG225I chip model supports advanced communication systems, making it a great choice for those who need to develop complex applications.
The XC5210-6BG225I chip model is expected to be in high demand in the future, as more and more applications require high-performance processing. The original design intention of the chip model was to make it easy to use and upgrade, and it has proven to be successful in this regard. With its high-speed performance, low power consumption, and wide range of features, it is an ideal choice for many applications.
In addition, the XC5210-6BG225I chip model is designed to be easily upgradable, allowing users to increase its performance and capabilities as their needs change. This makes it a great choice for those who need to develop advanced communication systems, as the processor can be easily upgraded to meet the requirements of these systems.
Overall, the XC5210-6BG225I chip model is an ideal choice for many applications, offering high-speed performance, low power consumption, and a wide range of features. It is also highly scalable and upgradable, making it a great choice for those who need to develop complex applications and advanced communication systems. With its many advantages, the XC5210-6BG225I chip model is expected to be in high demand in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||