AMD Xilinx
XC5210-5BG225I
XC5210-5BG225I ECAD Model
XC5210-5BG225I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 4.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA225,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-5BG225I Datasheet Download
XC5210-5BG225I Overview
The XC5210-5BG225I chip model is a powerful, versatile, and reliable integrated circuit that has been designed to meet the needs of a wide range of applications. It is a highly-integrated, cost-effective solution for advanced communication systems. This chip model is ideal for a variety of applications, including networked systems, intelligent scenarios, and fully intelligent systems.
The XC5210-5BG225I chip model is designed to provide the highest performance and reliability for a wide range of applications. The chip model features a high-speed, low-power, and low-cost design. It is also designed to be flexible and upgradable to meet the needs of the latest technologies. The chip model also features a variety of features, including high-speed data transfer, low latency, low power consumption, and a wide range of communication protocols.
The XC5210-5BG225I chip model is designed to provide a high-speed, low-power, and low-cost solution for advanced communication systems. The chip model is designed to be flexible and upgradable, allowing it to be used in a variety of applications, including networked systems, intelligent scenarios, and fully intelligent systems. The chip model is also designed to be reliable and robust, ensuring that it can be used in a wide range of applications.
The product description of the XC5210-5BG225I chip model includes a variety of features, including high-speed data transfer, low latency, low power consumption, and a wide range of communication protocols. Additionally, the chip model is designed to provide a reliable and robust solution for advanced communication systems. The chip model also features a variety of features, including high-speed data transfer, low latency, low power consumption, and a wide range of communication protocols.
The XC5210-5BG225I chip model is designed to be flexible and upgradable. This allows the chip model to be used in a variety of applications, including networked systems, intelligent scenarios, and fully intelligent systems. Additionally, the chip model is designed to be reliable and robust, ensuring that it can be used in a wide range of applications.
In addition to the product description, actual case studies and precautions should be taken into consideration when using the XC5210-5BG225I chip model. These case studies and precautions should include the use of proper testing and evaluation, as well as the implementation of proper safety measures. Additionally, the chip model should be tested and evaluated in accordance with the applicable standards and regulations.
The XC5210-5BG225I chip model is a powerful, versatile, and reliable integrated circuit that has been designed to meet the needs of a wide range of applications. It is a highly-integrated, cost-effective solution for advanced communication systems. This chip model is ideal for a variety of applications, including networked systems, intelligent scenarios, and fully intelligent systems. With its high-speed, low-power, and low-cost design, the chip model is designed to provide a reliable and robust solution for advanced communication systems. Additionally, the chip model is designed to be flexible and upgradable, allowing it to be used in a variety of applications. In order to ensure the chip model is used properly and safely, proper testing and evaluation, as well as the implementation of proper safety measures, should be taken into consideration.
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3,744 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.3146 | $22.3146 |
| 10+ | $22.0747 | $220.7466 |
| 100+ | $20.8750 | $2,087.4954 |
| 1000+ | $19.6752 | $9,837.6220 |
| 10000+ | $17.9957 | $17,995.6500 |
| The price is for reference only, please refer to the actual quotation! | ||