AMD Xilinx
XC5210-5BG225C
XC5210-5BG225C ECAD Model
XC5210-5BG225C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 4.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA225,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-5BG225C Datasheet Download
XC5210-5BG225C Overview
XC5210-5BG225C is a chip model from Xilinx, a world leader in programmable logic devices. It is a high-performance digital signal processor (DSP) that supports the use of HDL language. This chip model is suitable for high-performance digital signal processing, embedded processing, image processing, and other related applications.
The chip model XC5210-5BG225C has already been widely used in many industries, such as consumer electronics, automotive, aerospace, and defense. It is a reliable and powerful chip model that can be used to solve complex problems in these industries.
The future of XC5210-5BG225C is promising. With the rapid development of technology, the chip model can be applied to more intelligent scenarios. It can be used in networks and intelligent systems, such as autonomous driving, smart home, and artificial intelligence. With the support of new technologies, such as 5G, edge computing, and machine learning, the chip model can be used to create more powerful and efficient intelligent systems.
XC5210-5BG225C is a versatile chip model that can be used in many different applications. With its powerful performance, it can be used to solve complex problems in various industries. With the help of new technologies, it will be able to create more powerful and efficient intelligent systems. It is a reliable and powerful chip model that will continue to be widely used in the future.
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4,513 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.3146 | $22.3146 |
| 10+ | $22.0747 | $220.7466 |
| 100+ | $20.8750 | $2,087.4954 |
| 1000+ | $19.6752 | $9,837.6220 |
| 10000+ | $17.9957 | $17,995.6500 |
| The price is for reference only, please refer to the actual quotation! | ||