XC5210-4PQG160C
XC5210-4PQG160C
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rohs

AMD Xilinx

XC5210-4PQG160C


XC5210-4PQG160C
F20-XC5210-4PQG160C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP
QFP

XC5210-4PQG160C ECAD Model


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XC5210-4PQG160C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 10000
Number of CLBs 324
Combinatorial Delay of a CLB-Max 3.8 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 324 CLBS, 10000 GATES
Additional Feature MAX AVAILABLE 16000 LOGIC GATES
Clock Frequency-Max 83 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PQFP-G160
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 160
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP,
Pin Count 160
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC5210-4PQG160C Datasheet Download


XC5210-4PQG160C Overview



The chip model XC5210-4PQG160C is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is based on Xilinx’s Virtex-5 FPGA technology and is suitable for a wide range of applications in fields such as aerospace, defense, industrial, medical, and telecommunications. This chip model is designed to be programmed using the Hardware Description Language (HDL) and is capable of providing a high degree of flexibility and scalability.


The XC5210-4PQG160C chip model has a number of advantages that make it a great choice for many applications. It has a high-speed I/O, low-power consumption, and a wide range of features. It also offers a wide range of configurable options, allowing users to tailor the chip to their specific application needs. Additionally, the chip model is designed to be highly reliable, with a long life-cycle and a low failure rate.


The XC5210-4PQG160C chip model is expected to be in high demand in the coming years, as more and more applications require the use of advanced technologies. As the demand for these technologies increases, the demand for this chip model is likely to increase as well. For example, with the development of autonomous vehicles, the demand for chips with the ability to process large amounts of data quickly and accurately is expected to rise.


In terms of the application environment, the XC5210-4PQG160C chip model is designed to be used in a variety of different environments. It is capable of operating in both high-performance and low-power environments, and its configurable options allow users to tailor the chip to their specific application needs. Additionally, it is designed to be compatible with a wide range of technologies, including artificial intelligence (AI), the Internet of Things (IoT), and cloud computing.


Overall, the XC5210-4PQG160C chip model is a powerful and versatile integrated circuit that is designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the coming years, as more and more applications require the use of advanced technologies. Additionally, it is designed to be compatible with a wide range of technologies and is capable of operating in both high-performance and low-power environments. This chip model is a great choice for many applications and is sure to be a popular choice in the future.



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