
AMD Xilinx
XC5210-4PQG160C
XC5210-4PQG160C ECAD Model
XC5210-4PQG160C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 324 | |
Combinatorial Delay of a CLB-Max | 3.8 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 324 CLBS, 10000 GATES | |
Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC5210-4PQG160C Datasheet Download
XC5210-4PQG160C Overview
The chip model XC5210-4PQG160C is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is based on Xilinx’s Virtex-5 FPGA technology and is suitable for a wide range of applications in fields such as aerospace, defense, industrial, medical, and telecommunications. This chip model is designed to be programmed using the Hardware Description Language (HDL) and is capable of providing a high degree of flexibility and scalability.
The XC5210-4PQG160C chip model has a number of advantages that make it a great choice for many applications. It has a high-speed I/O, low-power consumption, and a wide range of features. It also offers a wide range of configurable options, allowing users to tailor the chip to their specific application needs. Additionally, the chip model is designed to be highly reliable, with a long life-cycle and a low failure rate.
The XC5210-4PQG160C chip model is expected to be in high demand in the coming years, as more and more applications require the use of advanced technologies. As the demand for these technologies increases, the demand for this chip model is likely to increase as well. For example, with the development of autonomous vehicles, the demand for chips with the ability to process large amounts of data quickly and accurately is expected to rise.
In terms of the application environment, the XC5210-4PQG160C chip model is designed to be used in a variety of different environments. It is capable of operating in both high-performance and low-power environments, and its configurable options allow users to tailor the chip to their specific application needs. Additionally, it is designed to be compatible with a wide range of technologies, including artificial intelligence (AI), the Internet of Things (IoT), and cloud computing.
Overall, the XC5210-4PQG160C chip model is a powerful and versatile integrated circuit that is designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the coming years, as more and more applications require the use of advanced technologies. Additionally, it is designed to be compatible with a wide range of technologies and is capable of operating in both high-performance and low-power environments. This chip model is a great choice for many applications and is sure to be a popular choice in the future.
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