AMD Xilinx
XC5210-4PQ208C
XC5210-4PQ208C ECAD Model
XC5210-4PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5210-4PQ208C Datasheet Download
XC5210-4PQ208C Overview
The XC5210-4PQ208C chip model is a powerful and reliable integrated circuit (IC) that has been designed to meet the needs of modern industry. It is a low-power, high-performance IC that is ideal for applications requiring a low power draw and high performance. The chip model is equipped with a wide array of features, making it a versatile choice for a variety of applications.
The XC5210-4PQ208C chip model is designed to be used in a wide range of applications, including automotive, consumer electronics, industrial automation, and medical fields. It is a highly reliable, low-power solution that is capable of performing multiple tasks simultaneously. The chip model is also designed to be compatible with a variety of operating systems, making it a great choice for a variety of projects.
The chip model is designed with a wide range of features, including a high-speed signal processing capability, a 12-bit analog-to-digital converter, a low-power sleep mode, and a wide range of communication protocols. The chip model also has a wide range of power management features and a wide range of input/output options. This makes it suitable for a variety of applications, including automotive, consumer electronics, and industrial automation.
The XC5210-4PQ208C chip model is expected to experience a high level of demand in the future, as it is a reliable and cost-effective solution for a variety of applications. The chip model is also expected to be used in a wide range of industries, including automotive, consumer electronics, industrial automation, and medical fields. With its wide range of features and its low-power design, the XC5210-4PQ208C chip model is an ideal choice for a variety of projects.
When considering the application environment for the XC5210-4PQ208C chip model, it is important to consider the specific technologies that are needed. The chip model is designed to be compatible with a variety of operating systems and communication protocols, so it is important to ensure that the necessary technologies are available. Additionally, it is important to consider the power management features and input/output options that are needed for the application.
Finally, it is important to consider the case studies and precautions that are necessary when using the XC5210-4PQ208C chip model in an application. It is important to understand the potential risks and the potential benefits of using the chip model in an application. Additionally, it is important to understand the proper techniques for using the chip model in an application. By understanding the proper techniques and the potential risks and benefits of using the chip model, it is possible to ensure that the application environment is optimized for the best possible performance.
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1,935 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $82.3637 | $82.3637 |
| 10+ | $81.4781 | $814.7805 |
| 100+ | $77.0499 | $7,704.9897 |
| 1000+ | $72.6217 | $36,310.8710 |
| 10000+ | $66.4223 | $66,422.3250 |
| The price is for reference only, please refer to the actual quotation! | ||