AMD Xilinx
XC5210-3TQG144C
XC5210-3TQG144C ECAD Model
XC5210-3TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3TQG144C Datasheet Download
XC5210-3TQG144C Overview
The XC5210-3TQG144C is a powerful chip model that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a Hardware Description Language (HDL) to create complex designs that can be used in a variety of applications.
The XC5210-3TQG144C has several advantages that make it ideal for use in a variety of industries. It is capable of running at high speeds, which makes it suitable for high-performance applications. It is also highly reliable and is able to withstand harsh environments. Additionally, it is cost-effective and can be programmed using HDL, which makes it easy to use.
In the future, the demand for the XC5210-3TQG144C is expected to increase due to its versatility and reliability. It can be used in a variety of applications, such as automotive, industrial, and consumer electronics. Additionally, it can be used in advanced communication systems, such as 5G networks and IoT devices.
The original design intention of the XC5210-3TQG144C was to provide a powerful, reliable, and cost-effective chip model that can be used in a variety of applications. It is designed to be used with HDL, which makes it easy to use and program. In addition, it is capable of running at high speeds, which makes it suitable for high-performance applications.
The XC5210-3TQG144C can be upgraded in the future to meet the needs of more advanced applications. It is possible to upgrade the chip model to be compatible with 5G networks and other advanced communication systems. Additionally, it can be used in a variety of other applications, such as automotive, industrial, and consumer electronics. The XC5210-3TQG144C is a versatile and reliable chip model that can be used in a variety of applications, and its demand is expected to increase in the future.
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4,691 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.6923 | $23.6923 |
| 10+ | $23.4376 | $234.3755 |
| 100+ | $22.1638 | $2,216.3772 |
| 1000+ | $20.8900 | $10,444.9960 |
| 10000+ | $19.1067 | $19,106.7000 |
| The price is for reference only, please refer to the actual quotation! | ||