AMD Xilinx
XC5210-3TQ144C
XC5210-3TQ144C ECAD Model
XC5210-3TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3TQ144C Datasheet Download
XC5210-3TQ144C Overview
The chip model XC5210-3TQ144C is a microcontroller developed by Xilinx, Inc., a leading provider of programmable logic devices and integrated circuits. The chip is a low-power, high-performance, single-core 32-bit microcontroller with an integrated 1.2 GHz ARM Cortex-M4 core. It is designed for embedded control applications such as industrial automation, robotics, and medical devices.
The XC5210-3TQ144C chip is a powerful and versatile device that can be used to develop advanced communication systems, intelligent robots, and other sophisticated applications. It supports a wide range of peripherals, including USB, Ethernet, Bluetooth, and Wi-Fi, as well as a variety of digital signal processing (DSP) and analog-to-digital conversion (ADC) peripherals. It also supports a wide range of development tools, including the Xilinx Vivado Design Suite and the Xilinx SDK.
The XC5210-3TQ144C chip is designed to meet the needs of the current industry trends and is capable of supporting future developments. It can be upgraded to support new technologies, such as 5G and AI, and can be applied to the development and popularization of future intelligent robots. In order to use the model effectively, technical talents with a good understanding of embedded systems, digital signal processing, and analog-to-digital conversion are required.
Looking to the future, the XC5210-3TQ144C chip is expected to be a popular choice for embedded control applications. Its powerful features and wide range of support make it an ideal choice for developers looking to create sophisticated and reliable applications. With the ever-evolving industry trends, the chip is sure to remain a leader in the field of embedded control applications.
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