AMD Xilinx
XC5210-3PQG208I
XC5210-3PQG208I ECAD Model
XC5210-3PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | TYP. GATES = 10000-16000 | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3PQG208I Datasheet Download
XC5210-3PQG208I Overview
The chip model XC5210-3PQG208I is a high-performance, low-power integrated circuit with a wide range of applications. It is the latest development in the field of integrated circuit technology and has been widely used in a variety of industries. The chip model XC5210-3PQG208I has the ability to support new technologies and applications, which makes it suitable for use in advanced communication systems.
As the chip model XC5210-3PQG208I is designed to be highly efficient, it is expected that the industry trends of the chip model XC5210-3PQG208I will continue to develop in the future. The chip model XC5210-3PQG208I has the potential to be upgraded and adapted to new technologies, which makes it suitable for use in the development and popularization of future intelligent robots. To use the model effectively, technical talents are needed to understand the chip model XC5210-3PQG208I and how to apply it in the most efficient way.
The chip model XC5210-3PQG208I has a wide range of applications, and its original design intention was to provide high-performance, low-power integrated circuits for a variety of industries. Its ability to support new technologies and applications make it a suitable choice for advanced communication systems, as well as the development and popularization of future intelligent robots. To use the model effectively, technical talents are needed to understand the chip model XC5210-3PQG208I and how to apply it in the most efficient way.
In conclusion, the chip model XC5210-3PQG208I is a high-performance, low-power integrated circuit with a wide range of applications. It is expected that the industry trends of the chip model XC5210-3PQG208I will continue to develop in the future, and it has the potential to be upgraded and adapted to new technologies. To use the model effectively, technical talents are needed to understand the chip model XC5210-3PQG208I and how to apply it in the most efficient way. This makes the chip model XC5210-3PQG208I a suitable choice for advanced communication systems, as well as the development and popularization of future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||