AMD Xilinx
XC5210-3PQG208C
XC5210-3PQG208C ECAD Model
XC5210-3PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3PQG208C Datasheet Download
XC5210-3PQG208C Overview
The chip model XC5210-3PQG208C is a state-of-the-art chip model designed to meet the needs of today’s rapidly evolving technology. It is designed to provide a high level of performance, scalability, and flexibility, making it an ideal choice for a wide range of applications. It is also designed for maximum efficiency, allowing for better power management and reduced heat dissipation.
The XC5210-3PQG208C chip model has a number of advantages, including its high speed and low power consumption. It also has a wide range of features, such as support for multiple protocols, high-speed data transfer, and advanced security features. The chip also offers excellent scalability, allowing for easy integration with other components, such as memory and storage. Additionally, it is designed to be compatible with a wide range of operating systems, making it suitable for a variety of applications.
The XC5210-3PQG208C chip model is expected to be in high demand in the future, as the need for advanced communication systems continues to grow. It is likely to be used in a variety of industries, from telecommunications to automotive, and it is expected to be used in a wide range of applications, from network infrastructure to consumer electronics. The chip model is also likely to be used in the development of intelligent systems, such as autonomous vehicles and smart home systems.
The XC5210-3PQG208C chip model is designed to be easily upgradable, allowing for future improvements in performance and features. It is also designed to be compatible with a wide range of operating systems and protocols, making it suitable for use in a variety of networks and intelligent scenarios. Additionally, the chip model is designed to be compatible with the latest technologies, such as 5G and Wi-Fi, allowing for easy integration with existing systems.
The XC5210-3PQG208C chip model is expected to be an important component of the future of intelligent systems, as it is designed to provide the necessary performance and scalability required to power these systems. It is also likely to be used in a wide range of applications, from network infrastructure to consumer electronics. The chip model is also expected to be used in a variety of industries, from telecommunications to automotive, making it an ideal choice for a wide range of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||