AMD Xilinx
XC5210-3PQ240I
XC5210-3PQ240I ECAD Model
XC5210-3PQ240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | TYP. GATES = 10000-16000 | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3PQ240I Datasheet Download
XC5210-3PQ240I Overview
The XC5210-3PQ240I chip model is a powerful and versatile tool for the development of advanced communication systems, intelligent robots, and other related industries. It is designed to provide exceptional performance, flexibility, and scalability, enabling users to create a wide range of applications.
The XC5210-3PQ240I chip model offers several advantages over other chip models. It is designed with a low-power consumption architecture, allowing it to be used in a wide range of applications without sacrificing performance. It also features a high-speed processor and memory, offering a high-performance computing experience. Additionally, the chip model supports a wide range of peripherals, making it suitable for a variety of applications.
The XC5210-3PQ240I chip model is also designed with the possibility for future upgrades. It is capable of supporting the latest hardware and software technologies, which can be used to improve its performance and expand its capabilities. Additionally, the chip model can be used to create advanced communication systems, such as 5G networks, as well as to develop and popularize future intelligent robots.
In terms of the technical expertise required to use the XC5210-3PQ240I chip model effectively, users should have a good understanding of the architecture and capabilities of the chip model. Additionally, they should be familiar with programming languages such as C++, Java, and Python. Furthermore, they should be knowledgeable in topics such as embedded systems, robotics, and artificial intelligence.
Given the advantages of the XC5210-3PQ240I chip model and the potential for future upgrades, it is expected that the demand for this model will continue to increase in the future. It is an ideal tool for the development and popularization of advanced communication systems and intelligent robots, and its capabilities make it suitable for a wide range of applications. With the right technical expertise, users can use the XC5210-3PQ240I chip model to create powerful and innovative applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||