AMD Xilinx
XC5210-3PQ240C
XC5210-3PQ240C ECAD Model
XC5210-3PQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5210-3PQ240C Datasheet Download
XC5210-3PQ240C Overview
The XC5210-3PQ240C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a HDL language, allowing for a high level of control over the chip's functions.
The XC5210-3PQ240C chip model is well-suited for a variety of applications, ranging from consumer electronics to industrial automation. It is also suitable for more advanced applications such as advanced communication systems.
The XC5210-3PQ240C chip model is designed to be future-proof, allowing for easy upgrades and modifications to keep up with advances in technology. This makes it ideal for applications that require the use of new technologies.
The original design intention of the XC5210-3PQ240C chip model was to provide a powerful, yet easy to use platform for digital signal processing. It is designed to be highly efficient and reliable, making it an ideal choice for applications that require high performance.
The XC5210-3PQ240C chip model is at the forefront of industry trends and is likely to remain so for the foreseeable future. As technology advances, it is likely that the chip model will need to be upgraded to keep up with the times. This is something that the chip model is designed to be able to do with ease.
In conclusion, the XC5210-3PQ240C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be future-proof and can easily be upgraded to keep up with advances in technology. It is suitable for a variety of applications, ranging from consumer electronics to industrial automation, as well as more advanced applications such as advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||