AMD Xilinx
XC5210-3PQ160I
XC5210-3PQ160I ECAD Model
XC5210-3PQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | TYP. GATES = 10000-16000 | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3PQ160I Datasheet Download
XC5210-3PQ160I Overview
The chip model XC5210-3PQ160I is a cutting-edge technology that has been developed to meet the needs of the ever-changing technological landscape. It is a highly advanced chip model that is designed for a wide range of applications, from consumer electronics to industrial applications. It is a highly reliable and efficient chip model that offers superior performance and features.
The XC5210-3PQ160I is a powerful chip model that is capable of supporting a variety of applications. It is capable of supporting a wide range of networks, from wired to wireless, as well as a wide range of intelligent scenarios. It is also capable of supporting the latest technologies and protocols, such as 5G and Wi-Fi 6, which are becoming increasingly important in the era of the Internet of Things (IoT).
The chip model XC5210-3PQ160I is expected to be in high demand in the future due to its advanced features and capabilities. It is expected to be used in a wide range of applications, from consumer electronics to industrial applications. In addition, it is expected to be used in networks and intelligent scenarios, such as the Internet of Things (IoT), autonomous vehicles, and smart home systems.
The XC5210-3PQ160I is an ideal chip model for the future of technology. It is expected to be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies and protocols. It is also capable of supporting a wide range of networks and intelligent scenarios, making it an ideal chip model for the future of technology.
In conclusion, the XC5210-3PQ160I is a cutting-edge chip model that is designed for a wide range of applications. It is highly reliable and efficient, and is capable of supporting a wide range of networks and intelligent scenarios. It is expected to be in high demand in the future due to its advanced features and capabilities, and is expected to be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||