AMD Xilinx
XC5210-3PQ160C
XC5210-3PQ160C ECAD Model
XC5210-3PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3PQ160C Datasheet Download
XC5210-3PQ160C Overview
The chip model XC5210-3PQ160C is one of the most advanced chips in the market today. It is designed to meet the needs of a variety of industries, including communications, robotics, and other advanced applications. With its advanced features and capabilities, the XC5210-3PQ160C is a powerful chip that can be used to create a wide range of products and systems.
The XC5210-3PQ160C is designed with a number of advantages that make it an ideal choice for many applications. It features a low power consumption, high speed, and high reliability. It also has an integrated memory controller, which allows for fast access to data from multiple sources. Additionally, the chip model is designed with a high level of scalability, allowing for easy upgrades and modifications.
The XC5210-3PQ160C is expected to be in high demand in the future, as more industries and applications require the use of advanced chips. In particular, the chip model is expected to be used in the development and popularization of future intelligent robots. This is due to its ability to provide the necessary power, speed, and reliability for the development of advanced robotic systems.
In order to use the XC5210-3PQ160C effectively, it is important to have the right technical talent. This includes engineers and technicians who are familiar with the chip model and have the necessary skills to work with it. Additionally, it is important to have a team of experts who can help with the integration of the chip model into existing systems.
The XC5210-3PQ160C is an advanced chip model that has the potential to revolutionize many industries. With its low power consumption, high speed, and high reliability, it is an ideal choice for many applications. Additionally, its scalability and integrated memory controller make it possible to upgrade and modify the chip model for future applications. As demand for advanced chips increases, the XC5210-3PQ160C is expected to be in high demand in the future. With the right technical talent and expertise, this chip model can be used to develop and popularize future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||