AMD Xilinx
XC5210-3PC84C
XC5210-3PC84C ECAD Model
XC5210-3PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5210-3PC84C Datasheet Download
XC5210-3PC84C Overview
The XC5210-3PC84C chip model is a powerful and versatile processor designed for a variety of applications. It is particularly suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. To use the chip effectively, it is necessary to have a good understanding of the Hardware Description Language (HDL). This language is used to program the chip and to control the various operations it can perform.
The original design intention of the XC5210-3PC84C was to provide a high-performance processor for a variety of applications. It was designed to be flexible and upgradeable, so that it could be used in a variety of different applications. This makes it possible to use the chip in advanced communication systems, such as 5G networks.
The XC5210-3PC84C is also suitable for use in the development and popularization of future intelligent robots. This is because it has the necessary computing power and flexibility to be able to handle the complex tasks that robots will require. To use the chip effectively, it is necessary to have a good understanding of the HDL language and the hardware design principles.
In conclusion, the XC5210-3PC84C is a powerful and versatile processor that can be used for a variety of applications. It is particularly suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. To use the chip effectively, it is necessary to have a good understanding of the Hardware Description Language (HDL) and the hardware design principles. This chip is also suitable for use in the development and popularization of future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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