AMD Xilinx
XC5206-6TQ144C
XC5206-6TQ144C ECAD Model
XC5206-6TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 117 | |
| Number of Outputs | 117 | |
| Number of Logic Cells | 784 | |
| Number of Equivalent Gates | 6000 | |
| Number of CLBs | 196 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 6000 GATES | |
| Additional Feature | MAX AVAILABLE 10000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5206-6TQ144C Datasheet Download
XC5206-6TQ144C Overview
Chip model XC5206-6TQ144C is a highly advanced integrated circuit developed by Xilinx Inc. It is a highly efficient and cost-effective solution for a wide range of applications, including digital signal processing, embedded computing, and communication systems. This chip model is designed to meet the needs of a variety of applications, ranging from consumer electronics to industrial automation.
The main advantages of the XC5206-6TQ144C chip model include its high performance, low power consumption, and small size. It has a high-speed transceiver, which is capable of transmitting data at a rate of up to 6.25 Gbps. It also features a low-power, low-latency, and low-cost FPGA architecture, which makes it ideal for embedded applications. In addition, the chip model is equipped with a large number of I/O pins, which makes it suitable for a wide range of applications.
The expected demand for the XC5206-6TQ144C chip model is likely to increase in the future. This is due to the increasing popularity of advanced communication systems, such as 5G, which require highly efficient and cost-effective solutions. Additionally, the chip model is expected to be used in a variety of applications, such as automotive, medical, and industrial automation.
The original design intention of the XC5206-6TQ144C chip model was to provide a highly efficient and cost-effective solution for a wide range of applications. It is designed to meet the needs of a variety of applications, ranging from consumer electronics to industrial automation. The chip model is also designed to provide high performance, low power consumption, and small size, which makes it suitable for a wide range of applications.
The XC5206-6TQ144C chip model is also capable of being upgraded in the future. It can be upgraded to support new features and technologies, such as 5G, as well as increased performance and power efficiency. In addition, the chip model is designed to be compatible with a variety of communication systems, such as Ethernet, Wi-Fi, and Bluetooth, which makes it suitable for advanced communication systems.
The product description and specific design requirements of the XC5206-6TQ144C chip model are as follows. It has a high-speed transceiver, which is capable of transmitting data at a rate of up to 6.25 Gbps. It also features a low-power, low-latency, and low-cost FPGA architecture, which makes it ideal for embedded applications. In addition, the chip model is equipped with a large number of I/O pins, which makes it suitable for a wide range of applications.
There are a number of case studies and precautions that should be taken into consideration when using the XC5206-6TQ144C chip model. For example, it is important to ensure that the chip model is properly cooled, as it may become overheated if not cooled properly. Additionally, it is important to ensure that the chip model is properly configured and that the appropriate drivers and software are installed. Lastly, it is important to ensure that the chip model is properly tested before being put into use.
In conclusion, the XC5206-6TQ144C chip model is a highly advanced integrated circuit developed by Xilinx Inc. It is designed to provide a highly efficient and cost-effective solution for a wide range of applications, including digital signal processing, embedded computing, and communication systems. It has a high-speed transceiver, which is capable of transmitting data at a rate of up to 6.25 Gbps. It also features a low-power, low-latency, and low-cost FPGA architecture, which makes it ideal for embedded applications. The chip model is also capable of being upgraded in the future, and it is expected to be used in a variety of applications, such as automotive, medical, and industrial automation. It is important to ensure that the chip model is properly cooled, configured, and tested before being put into use.
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