AMD Xilinx
XC5206-6PQG208I
XC5206-6PQG208I ECAD Model
XC5206-6PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 6000 | |
| Number of CLBs | 196 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 6000 GATES | |
| Additional Feature | MAX AVAILABLE 10000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5206-6PQG208I Datasheet Download
XC5206-6PQG208I Overview
The chip model XC5206-6PQG208I is a powerful, versatile and reliable chip model that is widely used in a variety of industries. It is a low power, high performance, and flexible solution for a variety of applications. This chip model is designed to provide a wide range of features, including high speed data transfer, low power consumption, low noise, and high reliability. It is suitable for a variety of embedded applications, such as automotive, industrial, medical and consumer electronics.
The XC5206-6PQG208I has a number of advantages, such as its low power consumption, high speed data transfer, and low noise. In addition, it has a high level of reliability, which is important for embedded applications. It also supports a wide range of features, including high speed data transfer, low power consumption, low noise, and high reliability. The chip is also designed to be very flexible, allowing for a variety of applications.
The XC5206-6PQG208I is expected to be in high demand in the future. This chip model is becoming increasingly popular in the automotive, industrial, medical and consumer electronics industries. This is due to the fact that it is a low power, high performance, and flexible solution for a variety of applications. As the demand for these types of applications increases, the demand for this chip model is expected to continue to grow.
The product description and design requirements of the XC5206-6PQG208I are quite straightforward. It is a low power, high performance, and flexible solution for a variety of applications. It supports a wide range of features, including high speed data transfer, low power consumption, low noise, and high reliability. The chip is also designed to be very flexible, allowing for a variety of applications.
In terms of actual case studies and precautions, the XC5206-6PQG208I is used in a variety of applications, including automotive, industrial, medical and consumer electronics. It is important to ensure that the application environment is suitable for the chip model, and that the specific technologies required are supported. For example, if the application requires high speed data transfer, then the chip must support this feature. It is also important to ensure that the chip is used in the correct environment in order to ensure its reliability.
In conclusion, the XC5206-6PQG208I is a powerful, versatile and reliable chip model that is widely used in a variety of industries. It has a number of advantages, such as its low power consumption, high speed data transfer, and low noise. It is expected to be in high demand in the future due to its wide range of features and its flexibility. It is important to ensure that the application environment is suitable for the chip model, and that the specific technologies required are supported.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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