AMD Xilinx
XC5204-6TQG144C
XC5204-6TQG144C ECAD Model
XC5204-6TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 4000 | |
| Number of CLBs | 120 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 120 CLBS, 4000 GATES | |
| Additional Feature | MAX AVAILABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5204-6TQG144C Datasheet Download
XC5204-6TQG144C Overview
The XC5204-6TQG144C chip model is a highly advanced and sophisticated model that has been designed with the intention of providing a powerful and reliable solution for communication systems. This chip model is designed to provide an efficient and reliable platform for a wide range of applications, such as advanced communication systems, and is capable of being upgraded to meet the needs of future technologies.
The XC5204-6TQG144C chip model is equipped with a number of features that make it an ideal choice for a variety of applications. This chip model is designed to provide a comprehensive solution for communication systems, and is capable of providing high performance, reliability and scalability. It is also capable of providing a wide range of features, such as high speed communication, low power consumption, high data transfer rates, and advanced security features.
In addition to its ability to provide a powerful and reliable solution for communication systems, the XC5204-6TQG144C chip model is also capable of being applied to the development and popularization of future intelligent robots. This chip model is designed to provide a comprehensive solution for robotic applications, and is capable of providing high performance, reliability and scalability. It is also capable of providing a wide range of features, such as high speed communication, low power consumption, high data transfer rates, and advanced security features.
In order to effectively use the XC5204-6TQG144C chip model, it is important to understand the product description, specific design requirements, and actual case studies of the chip model. It is also important to take into consideration any potential issues that may arise when using the model, such as compatibility with other components, power consumption, and other technical requirements. In addition, it is important to understand the technical talents that are needed to use the model effectively, such as knowledge of microprocessors, embedded systems, and communication systems.
Overall, the XC5204-6TQG144C chip model is a powerful and reliable solution for communication systems, and is capable of being applied to the development and popularization of future intelligent robots. It is important to understand the product description, specific design requirements, and actual case studies of the chip model, in order to effectively use the model. In addition, it is important to understand the technical talents that are needed to use the model effectively, such as knowledge of microprocessors, embedded systems, and communication systems.
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