AMD Xilinx
XC5204-4PQG160C
XC5204-4PQG160C ECAD Model
XC5204-4PQG160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 4000 | |
| Number of CLBs | 120 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 120 CLBS, 4000 GATES | |
| Additional Feature | MAX AVAILABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 160 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5204-4PQG160C Datasheet Download
XC5204-4PQG160C Overview
The XC5204-4PQG160C chip model is a powerful and versatile model, suitable for high-performance digital signal processing, embedded processing, image processing and other application scenarios. It requires the use of HDL language, which is a hardware description language used to describe the behavior of electronic systems.
The industry trends of the chip model XC5204-4PQG160C and the future development of related industries depend on what specific technologies are needed. With the development of artificial intelligence, the application of the chip model XC5204-4PQG160C in the development and popularization of future intelligent robots is possible. To use the model effectively, technical talents with knowledge of HDL language and related technologies are needed.
The XC5204-4PQG160C chip model can be used to create a wide range of applications, from simple digital signal processing to complex embedded processing and image processing. In addition, the chip can be used to develop and popularize future intelligent robots. To effectively use the model, technical talents with knowledge of HDL language and related technologies are needed.
The XC5204-4PQG160C chip model is a powerful and versatile model, capable of handling a wide range of applications. This makes it an ideal choice for high-performance digital signal processing, embedded processing, image processing and other applications. To use the model effectively, technical talents with knowledge of HDL language and related technologies are needed.
The chip model XC5204-4PQG160C is an important tool for the development and popularization of future intelligent robots. It is suitable for creating a wide range of applications, from simple digital signal processing to complex embedded processing and image processing. To effectively use the model, technical talents with knowledge of HDL language and related technologies are needed.
In conclusion, the XC5204-4PQG160C chip model is a powerful and versatile model, suitable for high-performance digital signal processing, embedded processing, image processing and other application scenarios. It requires the use of HDL language, and technical talents with knowledge of HDL language and related technologies are needed to use the model effectively. In addition, the chip model XC5204-4PQG160C can be used to develop and popularize future intelligent robots. The industry trends of the chip model XC5204-4PQG160C and the future development of related industries depend on what specific technologies are needed.
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|---|---|---|
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