AMD Xilinx
XC5204-3PQ160C
XC5204-3PQ160C ECAD Model
XC5204-3PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 124 | |
| Number of Outputs | 124 | |
| Number of Logic Cells | 120 | |
| Number of Equivalent Gates | 4000 | |
| Number of CLBs | 120 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 120 CLBS, 4000 GATES | |
| Additional Feature | MAX AVAILABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5204-3PQ160C Datasheet Download
XC5204-3PQ160C Overview
The XC5204-3PQ160C is a highly advanced chip model that is at the forefront of the semiconductor industry. It is a low-power, high-performance Field Programmable Gate Array (FPGA) that is designed to meet the needs of a variety of applications. It is an ideal solution for a wide range of applications, including embedded systems, industrial automation, and communication systems.
The chip model XC5204-3PQ160C offers a number of advantages. It is designed for high-speed operation and can operate at speeds up to 8.5GHz. It also has a wide range of features that make it suitable for a variety of applications, including high-speed data transfer, low-power operation, and high-speed I/O. Additionally, it is designed to be cost-effective and has a low power consumption.
The XC5204-3PQ160C is expected to be in high demand in the future, as it is suitable for a wide range of applications. It is expected to be used in a variety of communication systems, such as 5G networks, as well as in industrial automation and embedded systems. It is also expected to be used in advanced communication systems, such as radio frequency systems, as it is designed to be highly compatible with a variety of communication protocols.
The original design intention of the XC5204-3PQ160C was to provide a cost-effective, high-performance solution for a wide range of applications. It was designed to be highly compatible with a variety of communication protocols, and to be able to operate at high speeds. It was also designed to be low-power, and to be able to operate at low power consumption.
As technology advances, the XC5204-3PQ160C may need to be upgraded in order to meet the needs of advanced communication systems. It is possible that the chip model may need to be upgraded to support new technologies, such as 5G networks. However, it is also possible that the chip model may be able to remain compatible with existing communication protocols, and may not require any upgrades.
In conclusion, the XC5204-3PQ160C is a highly advanced chip model that is designed to meet the needs of a variety of applications. It is expected to be in high demand in the future, as it is suitable for a wide range of applications, including 5G networks, industrial automation, and embedded systems. It is also possible that the chip model may need to be upgraded in order to meet the needs of advanced communication systems in the future.
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1,776 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $18.3024 | $18.3024 |
| 10+ | $18.1056 | $181.0560 |
| 100+ | $17.1216 | $1,712.1600 |
| 1000+ | $16.1376 | $8,068.8000 |
| 10000+ | $14.7600 | $14,760.0000 |
| The price is for reference only, please refer to the actual quotation! | ||