AMD Xilinx
XC5202-6PQG100C
XC5202-6PQG100C ECAD Model
XC5202-6PQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5202-6PQG100C Datasheet Download
XC5202-6PQG100C Overview
The XC5202-6PQG100C is a chip model designed to meet the high-performance needs of digital signal processing, embedded processing, and image processing. This chip model is designed to be used with HDL (Hardware Description Language), which is a programming language used to describe the architecture of digital systems. It is also used to describe the behavior of the system and the interaction between the components.
The original design intention of the XC5202-6PQG100C was to provide a high-performance, reliable, and cost-effective solution for digital signal processing and image processing applications. The chip model is also designed to be upgradable, so that it can be used for more advanced communication systems in the future.
The product description of the XC5202-6PQG100C includes its features such as its high-performance processing capabilities, low power consumption, and low cost. It also includes its design requirements such as its HDL compatibility, its ability to be used in a wide range of applications, and its upgradability. It is also important to note that the chip model is designed to be used with specific hardware components and software tools.
To ensure the successful implementation of the chip model, it is important to consider the actual case studies and precautions. When using the XC5202-6PQG100C, it is important to consider the specific design requirements of the chip model, such as its HDL compatibility, its ability to be used in a wide range of applications, and its upgradability. It is also important to consider the hardware components and software tools that are necessary for the successful implementation of the chip model. Additionally, it is important to consider the potential risks associated with using the chip model, such as the potential for data loss or system failure due to incorrect implementation.
In conclusion, the XC5202-6PQG100C is a high-performance chip model designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL and is upgradable for more advanced communication systems. It is important to consider the product description and design requirements of the chip model, as well as the actual case studies and precautions when using the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||