AMD Xilinx
XC5202-4VQ100I
XC5202-4VQ100I ECAD Model
XC5202-4VQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 84 | |
| Number of Outputs | 84 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | TYP. GATES = 2000-3000 | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, TQFP100,.63SQ | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5202-4VQ100I Datasheet Download
XC5202-4VQ100I Overview
The XC5202-4VQ100I chip model is a powerful and versatile solution for advanced communication systems. Developed by Xilinx, this model is designed to provide a high-performance, low-power solution that can be used in a variety of applications. It is a multi-core processor that is capable of running multiple applications simultaneously, allowing for greater flexibility and scalability.
The XC5202-4VQ100I chip model was designed with the intention of providing a reliable, high-performance solution that can easily adapt to changing needs. It is capable of supporting a wide range of protocols, including Ethernet, Wi-Fi, Bluetooth, and more. This makes it an ideal choice for applications in networks and other communication systems. Additionally, its low-power consumption makes it a great choice for use in embedded systems.
The XC5202-4VQ100I chip model is capable of supporting various intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. Its multi-core architecture allows it to handle multiple tasks simultaneously, making it suitable for use in the era of fully intelligent systems. Additionally, it is capable of handling large amounts of data, which makes it a great choice for applications that require data-intensive operations.
In terms of product design, the XC5202-4VQ100I chip model is equipped with a variety of features, such as a high-speed processor, a low-power consumption design, and a wide range of interface options. It is also equipped with a variety of on-chip peripherals, such as an ADC, DAC, UART, and more. Additionally, the chip model is designed to be highly reliable and durable, with a wide temperature range and a wide range of voltage levels.
The XC5202-4VQ100I chip model has been successfully used in a variety of projects and applications. For example, it has been used in various medical devices, such as patient monitors and imaging systems. Additionally, it has been used in a variety of industrial applications, such as factory automation and robotics.
When using the XC5202-4VQ100I chip model, it is important to take into account the specific design requirements of the application. Additionally, the chip model should be tested and verified before being used in any production environment. Finally, it is important to be aware of the potential risks associated with using the chip model, such as power surges, overheating, and other issues.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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