XC5202-4PQG100C
XC5202-4PQG100C
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rohs

AMD Xilinx

XC5202-4PQG100C


XC5202-4PQG100C
F20-XC5202-4PQG100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP
QFP

XC5202-4PQG100C ECAD Model


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XC5202-4PQG100C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 2000
Number of CLBs 64
Combinatorial Delay of a CLB-Max 3.8 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape RECTANGULAR
Technology CMOS
Organization 64 CLBS, 2000 GATES
Additional Feature MAX AVAILABLE 3000 LOGIC GATES
Clock Frequency-Max 83 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 40
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 14 mm
Length 20 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description QFP,
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC5202-4PQG100C Datasheet Download


XC5202-4PQG100C Overview



The XC5202-4PQG100C chip model is a powerful and reliable integrated circuit (IC) designed for a variety of applications in communications and networks. It is part of the Xilinx FPGA family and is designed to provide high-speed performance, low power consumption and scalability. This chip model was designed with the intention of providing users with an efficient and reliable solution for their communication and network needs.


The XC5202-4PQG100C chip model is capable of providing high-speed data transfer and is compatible with a variety of communication protocols. It is also capable of being used in a wide range of scenarios, including advanced communication systems, intelligent scenarios, and fully intelligent systems. This chip model is also capable of being upgraded in the future, allowing users to take advantage of the latest technologies and features.


The XC5202-4PQG100C chip model has a number of design requirements that must be met in order to ensure its performance and reliability. These requirements include the ability to support multiple protocols, high-speed data transfer, low power consumption, and scalability. In addition, this chip model must also be able to support a variety of different communication protocols and applications, such as Ethernet, Wi-Fi, Bluetooth, and others.


In order to ensure that the XC5202-4PQG100C chip model is able to meet the design requirements, a number of case studies and tests have been conducted. These case studies and tests have provided valuable information about the performance and reliability of this chip model, as well as any potential issues that may arise. In addition, these tests have also provided information about the potential for future upgrades and the possibility of applying this chip model to advanced communication systems.


Finally, it is important to note that the XC5202-4PQG100C chip model is not a “one-size-fits-all” solution. As such, users should be aware of the specific design requirements and any potential issues that may arise. In addition, users should also be aware of the potential for future upgrades and the possibility of applying this chip model to advanced communication systems. By taking all of these considerations into account, users can ensure that they are able to get the most out of their XC5202-4PQG100C chip model.



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