
AMD Xilinx
XC5202-4PQG100C
XC5202-4PQG100C ECAD Model
XC5202-4PQG100C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 3.8 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 64 CLBS, 2000 GATES | |
Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC5202-4PQG100C Datasheet Download
XC5202-4PQG100C Overview
The XC5202-4PQG100C chip model is a powerful and reliable integrated circuit (IC) designed for a variety of applications in communications and networks. It is part of the Xilinx FPGA family and is designed to provide high-speed performance, low power consumption and scalability. This chip model was designed with the intention of providing users with an efficient and reliable solution for their communication and network needs.
The XC5202-4PQG100C chip model is capable of providing high-speed data transfer and is compatible with a variety of communication protocols. It is also capable of being used in a wide range of scenarios, including advanced communication systems, intelligent scenarios, and fully intelligent systems. This chip model is also capable of being upgraded in the future, allowing users to take advantage of the latest technologies and features.
The XC5202-4PQG100C chip model has a number of design requirements that must be met in order to ensure its performance and reliability. These requirements include the ability to support multiple protocols, high-speed data transfer, low power consumption, and scalability. In addition, this chip model must also be able to support a variety of different communication protocols and applications, such as Ethernet, Wi-Fi, Bluetooth, and others.
In order to ensure that the XC5202-4PQG100C chip model is able to meet the design requirements, a number of case studies and tests have been conducted. These case studies and tests have provided valuable information about the performance and reliability of this chip model, as well as any potential issues that may arise. In addition, these tests have also provided information about the potential for future upgrades and the possibility of applying this chip model to advanced communication systems.
Finally, it is important to note that the XC5202-4PQG100C chip model is not a “one-size-fits-all” solution. As such, users should be aware of the specific design requirements and any potential issues that may arise. In addition, users should also be aware of the potential for future upgrades and the possibility of applying this chip model to advanced communication systems. By taking all of these considerations into account, users can ensure that they are able to get the most out of their XC5202-4PQG100C chip model.
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