AMD Xilinx
XC5202-4PQ100C
XC5202-4PQ100C ECAD Model
XC5202-4PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 84 | |
| Number of Outputs | 84 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5202-4PQ100C Datasheet Download
XC5202-4PQ100C Overview
The XC5202-4PQ100C chip model is a powerful, versatile integrated circuit that is widely used in a variety of applications. It is particularly suitable for high-performance digital signal processing, embedded processing, and image processing. In order to use this chip model, the user must have a basic understanding of the HDL (Hardware Description Language) language.
The XC5202-4PQ100C chip model is designed to provide a high level of performance and flexibility. It has a wide range of features and functions, including powerful arithmetic logic units, embedded RAM, and a large number of I/O pins. It also has a low power consumption and a wide operating temperature range. In addition, the chip model is also designed to be easily upgradable, making it possible to add new features and functions as needed.
The XC5202-4PQ100C chip model is expected to remain popular in the years to come, especially in industries that require high-performance digital signal processing. It is also likely to be used in advanced communication systems, as the chip model has been designed with the potential for future upgrades. The original design intention of the XC5202-4PQ100C was to provide a powerful, versatile integrated circuit with a wide range of features and functions, while also being able to easily upgrade and expand the capabilities of the chip model.
Overall, the XC5202-4PQ100C chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications. It is expected to remain popular in the years to come and is likely to be used in advanced communication systems. The chip model is designed to be easily upgradable, making it possible to add new features and functions as needed.
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|---|---|---|
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