AMD Xilinx
XC5202-4PCG84C
XC5202-4PCG84C ECAD Model
XC5202-4PCG84C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3.8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, | |
| Pin Count | 84 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC5202-4PCG84C Datasheet Download
XC5202-4PCG84C Overview
The XC5202-4PCG84C chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language, which is a powerful language for designing and implementing digital systems.
The XC5202-4PCG84C chip model is designed to meet the needs of a variety of industries, including automotive, consumer electronics, industrial automation, and medical devices. It is designed to be used in challenging environments, where high performance and reliability are essential. The chip model is designed to be highly efficient, with low power consumption and high performance.
In terms of industry trends, the XC5202-4PCG84C chip model is designed to be flexible and adaptable to changing technological needs. As new technologies emerge, the chip model can be easily adapted to meet the demands of the industry. The chip model is also designed to be compatible with existing technologies, so that existing systems can be upgraded with the latest features.
The product description of the XC5202-4PCG84C chip model outlines the features and capabilities of the chip model. It provides detailed information on the specifications, such as the number of pins, the range of voltage and frequency, and the power consumption. It also provides information on the package, the pinout, and the operating temperature range.
In terms of specific design requirements, the XC5202-4PCG84C chip model can be used in a wide range of applications, from embedded processing to image processing. It is designed to be used with the HDL language, which is a powerful language for designing and implementing digital systems. The chip model is designed to be highly efficient, with low power consumption and high performance.
Case studies can be used to provide a better understanding of how the chip model can be used in different applications. This can help developers to gain a better understanding of the design requirements and the capabilities of the chip model. Additionally, the case studies can provide insight into the best practices for using the chip model and how to optimize its performance.
Finally, it is important to note that the XC5202-4PCG84C chip model is designed to be used in challenging environments, where high performance and reliability are essential. It is important to consider the environment in which the chip model will be used and to ensure that it is suitable for the application. Additionally, it is important to ensure that the chip model is compatible with existing technologies, so that existing systems can be upgraded with the latest features.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||