
AMD Xilinx
XC5202-4PC84I
XC5202-4PC84I ECAD Model
XC5202-4PC84I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 84 | |
Number of Outputs | 84 | |
Number of Logic Cells | 64 | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 3.8 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 64 CLBS, 2000 GATES | |
Additional Feature | TYP. GATES = 2000-3000 | |
Clock Frequency-Max | 83 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQCC-J84 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 84 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.3116 mm | |
Length | 29.3116 mm | |
Seated Height-Max | 5.08 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | PLASTIC, LCC-84 | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC5202-4PC84I Datasheet Download
XC5202-4PC84I Overview
The chip model XC5202-4PC84I has been designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language, which is a powerful and versatile language for designing digital circuits. This chip model has a number of advantages compared to other models, such as its high-speed operation and its low power consumption. It also has a number of features that make it suitable for a variety of applications, such as its built-in FIFO memory and its support for multiple instruction sets.
The demand for the XC5202-4PC84I chip model is expected to increase in the future, as more applications require the use of high-performance digital signal processing, embedded processing, and image processing. This is due to the fact that these applications are becoming increasingly complex, and require more efficient and powerful chips. Additionally, the XC5202-4PC84I is designed to be compatible with a variety of platforms, making it a versatile choice for many applications.
The original design intention of the XC5202-4PC84I chip model was to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. The chip was designed to be low power and high speed, while still being able to support a variety of instruction sets. Additionally, the chip was designed to be compatible with a number of platforms, making it a versatile choice for many applications.
The XC5202-4PC84I chip model can be upgraded in the future, as new technologies become available and the needs of applications evolve. For example, the chip can be upgraded to support advanced communication systems, such as 5G or Wi-Fi 6. Additionally, the chip can be upgraded to support more powerful instruction sets and to increase its speed and power efficiency.
In conclusion, the XC5202-4PC84I chip model is a powerful and efficient solution for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be low power, high speed, and compatible with a variety of platforms, making it a versatile choice for many applications. Additionally, the chip can be upgraded in the future to support advanced communication systems, as well as more powerful instruction sets and to increase its speed and power efficiency.
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