
AMD Xilinx
XC5202-3PQG100I
XC5202-3PQG100I ECAD Model
XC5202-3PQG100I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 64 CLBS, 2000 GATES | |
Additional Feature | TYP. GATES = 2000-3000 | |
Clock Frequency-Max | 83 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC5202-3PQG100I Datasheet Download
XC5202-3PQG100I Overview
The XC5202-3PQG100I chip model is a powerful and versatile integrated circuit that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for design and development. This chip is an important part of the semiconductor industry, and its development has been closely followed by industry professionals.
The chip model XC5202-3PQG100I is a complex integrated circuit with a wide range of applications. Its design requirements are highly specific and require the use of advanced technologies to ensure the successful implementation of its intended purpose. To that end, the development of new technologies is often necessary to support the application environment.
Industry trends show that the XC5202-3PQG100I chip model is a popular choice for many applications. It is often used in the development of embedded systems and image processing applications, which require the use of advanced technologies. This chip is also used in the development of digital signal processing systems, which require the use of sophisticated algorithms and techniques.
When designing a product using the XC5202-3PQG100I chip model, it is important to consider the specific design requirements and product specifications. The chip model requires careful consideration of the application environment and the specific technologies needed to ensure a successful implementation. Additionally, it is important to consider the potential risks associated with the product, and to take necessary precautions to ensure the safety and reliability of the product.
Case studies of the XC5202-3PQG100I chip model can provide valuable insight into the design and development process. They can also help to identify potential risks and to develop strategies to mitigate those risks. By understanding the specific design requirements and the technologies needed to support the application environment, designers can ensure the successful implementation of the chip model.
In conclusion, the XC5202-3PQG100I chip model is a powerful and versatile integrated circuit that is suitable for a variety of applications. Its development is closely followed by industry professionals, and its design requirements are highly specific. The development of new technologies is often necessary to support the application environment, and case studies can provide valuable insight into the design and development process. By understanding the specific design requirements and the technologies needed to support the application environment, designers can ensure the successful implementation of the chip model.
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