AMD Xilinx
XC5202-3PQ100C
XC5202-3PQ100C ECAD Model
XC5202-3PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 84 | |
| Number of Outputs | 84 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5202-3PQ100C Datasheet Download
XC5202-3PQ100C Overview
The XC5202-3PQ100C chip model is a highly advanced and reliable model of the XC5200 series of programmable logic devices. Developed by Xilinx, this chip model is designed to meet the high-performance requirements of communication systems, providing users with a wide range of features and capabilities.
The XC5202-3PQ100C chip model contains a range of features that make it suitable for a variety of applications. It has a wide range of programmable logic blocks, allowing users to customize their designs to meet their specific requirements. It also has a high-speed clock and I/O, allowing for fast data transmission and processing. Additionally, the chip model features advanced power management, allowing for efficient operation and power savings.
The XC5202-3PQ100C chip model is designed to be highly scalable and upgradable. It can be used in a variety of communication systems, from basic to advanced. It is also compatible with a range of new technologies, making it suitable for use in the most demanding applications. Additionally, the chip model can be used in a variety of other applications, such as automotive, industrial, and medical.
In order to ensure the performance of the XC5202-3PQ100C chip model, it is important to understand the product description and specific design requirements. This includes understanding the features and capabilities of the chip model, as well as the actual case studies and precautions that should be taken when using the chip model. Additionally, it is important to understand the industry trends and the possibility of future upgrades, as well as the application environment and whether it requires the support of new technologies.
Overall, the XC5202-3PQ100C chip model is a highly advanced and reliable model of the XC5200 series of programmable logic devices. It is designed to meet the high-performance requirements of communication systems, providing users with a wide range of features and capabilities. It is also highly scalable and upgradable, making it suitable for a variety of applications. In order to ensure the performance of the chip model, it is important to understand the product description and specific design requirements, as well as the industry trends and the possibility of future upgrades.
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|---|---|---|
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