AMD Xilinx
XC4VSX35-10FFG668IS2
XC4VSX35-10FFG668IS2 ECAD Model
XC4VSX35-10FFG668IS2 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 34560 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA668,26X26,40 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4VSX35-10FFG668IS2 Datasheet Download
XC4VSX35-10FFG668IS2 Overview
The XC4VSX35-10FFG668IS2 chip model is a powerful tool for a variety of high-performance digital signal processing, embedded processing, and image processing applications. Its use requires the use of HDL language. As such, the industry trends and future development of related industries are dependent on the specific technologies that are needed.
In terms of its possible future applications, the XC4VSX35-10FFG668IS2 chip model could be used in networks and intelligent scenarios. It could be applied to the era of fully intelligent systems, enabling the development of smarter and more efficient networks and systems. The chip model could also be used to develop more advanced AI applications, with its powerful processing capabilities allowing for the creation of more complex algorithms.
The XC4VSX35-10FFG668IS2 chip model could also be used to support the growth of the Internet of Things (IoT). Its powerful processing capabilities and low power consumption could be used to create more efficient and reliable IoT systems. The chip model could also be used to create more secure and reliable networks, as well as to develop more advanced security applications.
The XC4VSX35-10FFG668IS2 chip model could also be used to develop more advanced embedded systems, with its low power consumption and high processing capabilities allowing for the creation of more efficient and reliable systems. The chip model could also be used to develop more advanced robotics systems, with its powerful processing capabilities and low power consumption allowing for the creation of more complex algorithms and systems.
In conclusion, the XC4VSX35-10FFG668IS2 chip model is a powerful tool for a variety of high-performance digital signal processing, embedded processing, and image processing applications. Its use requires the use of HDL language. As such, the industry trends and future development of related industries are dependent on the specific technologies that are needed. The chip model could be used to support the growth of the Internet of Things, create more efficient and reliable networks and systems, develop more advanced AI applications, and create more advanced embedded systems and robotics systems.
You May Also Be Interested In
4,631 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $685.3553 | $685.3553 |
| 10+ | $677.9859 | $6,779.8590 |
| 100+ | $641.1388 | $64,113.8844 |
| 1000+ | $604.2918 | $302,145.8920 |
| 10000+ | $552.7059 | $552,705.9000 |
| The price is for reference only, please refer to the actual quotation! | ||