
AMD Xilinx
XC4VLX40-12FFG668I
XC4VLX40-12FFG668I ECAD Model
XC4VLX40-12FFG668I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | TIN SILVER COPPER | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4VLX40-12FFG668I Datasheet Download
XC4VLX40-12FFG668I Overview
The XC4VLX40-12FFG668I is a chip model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for its application. As the chip model is gaining popularity in the industry, it is important to understand the trends, future development, and application environment requirements of the chip model.
The XC4VLX40-12FFG668I is designed to deliver high performance and reliability. It is based on a 40nm process technology and features 12-bit programmable logic, 8-bit arithmetic logic, four I/O banks, and four clock domains. It is also equipped with a large number of memory and register resources, making it suitable for a wide range of applications.
The chip model is suitable for a variety of applications, such as video and image processing, communications, automotive, and industrial applications. It is also capable of supporting various protocols and standards, such as Ethernet, USB, and CAN. It is also capable of providing support for various communication protocols, such as Ethernet, CAN, and USB.
In order to ensure the successful implementation of the chip model, the application environment must be designed to meet the specific design requirements of the chip model. This includes the selection of the appropriate HDL language, the selection of the appropriate tools and components, and the development of the necessary hardware and software components. It is also important to consider the scalability of the chip model, as well as the power consumption and the performance of the application.
Case studies and precautions should be taken into consideration when designing the application environment for the XC4VLX40-12FFG668I. For example, the chip model must be designed to meet the requirements of the specific application, and the design must be able to handle the required data throughput. Additionally, the design must be able to handle the power consumption and the performance of the application.
In order to ensure that the application environment is optimized for the XC4VLX40-12FFG668I, it is important to consider the latest industry trends and future development. This includes the selection of the appropriate tools and components, and the development of the necessary hardware and software components. Additionally, the application environment must be designed to take advantage of new technologies, such as machine learning and artificial intelligence.
Overall, the XC4VLX40-12FFG668I is a powerful and reliable chip model that is suitable for a variety of applications. In order to ensure the successful implementation of the chip model, it is important to consider the product description and specific design requirements, as well as the industry trends and future development. Additionally, the application environment must be designed to take advantage of new technologies, such as machine learning and artificial intelligence.
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4,628 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,039.4536 | $1,039.4536 |
10+ | $1,028.2766 | $10,282.7664 |
100+ | $972.3920 | $97,239.2040 |
1000+ | $916.5074 | $458,253.7200 |
10000+ | $838.2690 | $838,269.0000 |
The price is for reference only, please refer to the actual quotation! |