XC4VLX25-11FFG676C

The XC4VLX25-11FFG676C is a low-power, high-performance, FPGA chip from Xilinx. It is manufactured using the company’s advanced Virtex-4 technology, making it suitable for a wide range of applications. The chip has 25,160 logic cells and 5,000 flip-flops, and is designed to operate at a maximum frequency of 333 MHz. It has a total of 676 I/O pins, which can be used to connect to external devices. The chip also features up to 1.5 Mbits of embedded RAM and 4 DSP slices.

The XC4VLX25-11FFG676C is designed for a wide range of applications, including embedded systems, telecommunications, networking, automotive, and industrial control. It is ideal for applications that require high performance and low power consumption. The chip is also suitable for applications that require high-speed data transfer and complex logic functions.

The chip is available in a range of packages, including a BGA, PQFP, and TQFP. It has a power dissipation of 1.8W and a junction temperature range of 0 to 85°C. It is also RoHS compliant and has a full-featured JTAG interface for programming and debugging.

In conclusion, the XC4VLX25-11FFG676C is a high-performance, low-power FPGA chip from Xilinx. It is suitable for a wide range of applications, including embedded systems, telecommunications, networking, automotive, and industrial control. The chip features up to 25,160 logic cells, 5,000 flip-flops, 676 I/O pins, 1.5 Mbits of embedded RAM, and 4 DSP slices. It is available in a range of packages, has a power dissipation of 1.8W, and is RoHS compliant.