AMD Xilinx
XC4VLX25-11FF676C
XC4VLX25-11FF676C ECAD Model
XC4VLX25-11FF676C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 24192 | |
| Number of CLBs | 2688 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS | |
| Clock Frequency-Max | 1.205 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4VLX25-11FF676C Datasheet Download
XC4VLX25-11FF676C Overview
The XC4VLX25-11FF676C chip model is a high-performance model designed for digital signal processing, embedded processing, image processing, and other applications. This model requires the use of HDL language, which is a versatile programming language that is used to create, simulate, and test hardware designs.
The XC4VLX25-11FF676C model has several advantages, including high-speed performance, low power consumption, and a wide range of features. It is also highly customizable and can be adapted to the specific needs of the user. This makes the model suitable for a range of different applications.
The demand for the XC4VLX25-11FF676C model is likely to increase in the future, as the need for high-performance digital signal processing and embedded processing continues to grow. This is especially true in the fields of image processing, artificial intelligence, and machine learning, which all require high-performance hardware.
The future development of the XC4VLX25-11FF676C model and related industries will depend on what specific technologies are needed. For example, new technologies such as 5G, edge computing, and cloud computing may require the support of this model in order to run efficiently. Additionally, the model may need to be adapted to the changing needs of the user, such as the need for higher speed or lower power consumption.
Overall, the XC4VLX25-11FF676C model is a versatile, high-performance chip model that is suitable for a range of applications. Its advantages and expected demand trends in related industries suggest that it will remain a popular choice in the future. The development of the model and related industries will depend on the specific technologies that are needed in the application environment.
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4,056 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $732.2526 | $732.2526 |
| 10+ | $724.3789 | $7,243.7893 |
| 100+ | $685.0105 | $68,501.0508 |
| 1000+ | $645.6421 | $322,821.0440 |
| 10000+ | $590.5263 | $590,526.3000 |
| The price is for reference only, please refer to the actual quotation! | ||