AMD Xilinx
XC4VLX25-10FF668CS2
XC4VLX25-10FF668CS2 ECAD Model
XC4VLX25-10FF668CS2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 24192 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4VLX25-10FF668CS2 Datasheet Download
XC4VLX25-10FF668CS2 Overview
The XC4VLX25-10FF668CS2 chip model is a highly advanced and powerful integrated circuit, designed for applications in high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, and is equipped with a wide range of features and capabilities.
The chip model is designed to be highly versatile and can be used in a variety of applications. It is capable of high-speed data processing, and can be used in applications such as embedded systems, image processing, and digital signal processing. It is also capable of handling complex tasks, and can be used in applications such as image recognition, facial recognition, and autonomous navigation.
The chip model is also designed to be highly reliable, with a low failure rate. It is designed to be able to withstand a wide range of environmental conditions, and is capable of withstanding extreme temperatures, humidity, and vibration. It is also designed to be able to handle a wide range of voltages, and is capable of operating in a wide range of power conditions.
The chip model is also designed to be highly efficient, and can be used in applications that require a high degree of power efficiency. It is capable of running at low power levels, and can be used in applications that require a low power consumption. It is also designed to be able to handle a wide range of input signals, and can be used in applications that require a high degree of accuracy.
The chip model is also designed to be highly secure, and can be used in applications that require a high degree of security. It is designed to be able to protect against malicious attacks, and is capable of preventing unauthorized access to data. It is also designed to be able to protect against data tampering and data loss.
The industry trends of the chip model XC4VLX25-10FF668CS2 and the future development of related industries depend on the specific technologies that are needed. In order to determine which technologies are needed, it is important to understand the product description and specific design requirements of the chip model. Additionally, actual case studies and precautions should be taken into consideration when designing and implementing the chip model.
Overall, the XC4VLX25-10FF668CS2 chip model is a highly advanced and powerful integrated circuit, designed for applications in high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, and is equipped with a wide range of features and capabilities. It is designed to be highly reliable, efficient, and secure, and can be used in a variety of applications. In order to determine which technologies are needed for a particular application, it is important to understand the product description and specific design requirements of the chip model, as well as actual case studies and precautions.
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