
AMD Xilinx
XC4VLX100-12FFG1513I
XC4VLX100-12FFG1513I ECAD Model
XC4VLX100-12FFG1513I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | TIN SILVER COPPER | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4VLX100-12FFG1513I Datasheet Download
XC4VLX100-12FFG1513I Overview
The XC4VLX100-12FFG1513I chip model is a powerful and versatile tool that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of HDL language, making it a great choice for those who want to create complex designs with a high degree of accuracy and reliability.
The XC4VLX100-12FFG1513I chip model has a wide range of features that make it an ideal choice for many different industries. It is capable of handling large amounts of data quickly and accurately, making it a great choice for applications that require high-performance computing. Additionally, it is highly reliable and can handle a wide range of tasks, including image processing and embedded systems.
The industry trends for the XC4VLX100-12FFG1513I chip model are constantly evolving, as new technologies are developed and implemented. As such, it is important to keep up with the latest advancements in order to ensure that the chip model is able to meet the needs of the application environment. Additionally, it is important to consider the specific design requirements of the chip model when creating a design, as each environment has different requirements.
When designing with the XC4VLX100-12FFG1513I chip model, it is important to consider the product description, as well as any case studies or precautions that may be necessary. Additionally, it is important to consider the specific design requirements of the chip model and the application environment, as different technologies may be needed for different applications. It is also important to keep up with the latest advancements in technology, as new technologies may be required in order to meet the needs of the application environment. By doing so, designers can ensure that their designs are successful and able to meet the needs of the application.
2,169 In Stock






Pricing (USD)
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