AMD Xilinx
XC4VFX20-10FFG672IS1
XC4VFX20-10FFG672IS1 ECAD Model
XC4VFX20-10FFG672IS1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 19224 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | BGA, BGA672,26X26,40 |
XC4VFX20-10FFG672IS1 Datasheet Download
XC4VFX20-10FFG672IS1 Overview
The XC4VFX20-10FFG672IS1 chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL (Hardware Description Language) language, making it an ideal choice for a wide range of applications.
The XC4VFX20-10FFG672IS1 chip model is designed to be highly versatile and customizable, allowing users to tailor its functionality to their needs. It is capable of performing a variety of tasks, from simple data processing to complex image processing. This chip model is well-suited for a variety of applications, including medical imaging, robotics, and communications systems.
The industry trends of the XC4VFX20-10FFG672IS1 chip model are constantly evolving, and new technologies are being developed to meet the growing demands of the market. For example, as the demand for faster data processing increases, new technologies such as artificial intelligence and machine learning are being used to increase the speed and accuracy of data processing. Similarly, as the demand for more efficient communication systems increases, new technologies such as 5G are being developed to meet these needs.
The original design intention of the XC4VFX20-10FFG672IS1 chip model was to provide an efficient and powerful tool for digital signal processing, embedded processing, and image processing. It is capable of performing a variety of tasks, from simple data processing to complex image processing. The chip model also has the potential to be upgraded in the future, allowing users to increase its capabilities and performance. In addition, it is also possible to apply the XC4VFX20-10FFG672IS1 chip model to advanced communication systems, such as 5G, due to its powerful processing capabilities.
In conclusion, the XC4VFX20-10FFG672IS1 chip model is an ideal choice for a wide range of applications, from medical imaging to robotics and communications systems. It is designed to be highly versatile and customizable, allowing users to tailor its functionality to their needs. The chip model is also capable of being upgraded in the future, allowing users to increase its capabilities and performance. Finally, it is possible to apply the XC4VFX20-10FFG672IS1 chip model to advanced communication systems, such as 5G, due to its powerful processing capabilities.
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3,051 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $365.8806 | $365.8806 |
| 10+ | $361.9464 | $3,619.4640 |
| 100+ | $342.2754 | $34,227.5400 |
| 1000+ | $322.6044 | $161,302.2000 |
| 10000+ | $295.0650 | $295,065.0000 |
| The price is for reference only, please refer to the actual quotation! | ||