XC4VFX12-12FF668I
XC4VFX12-12FF668I
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rohs

AMD Xilinx

XC4VFX12-12FF668I


XC4VFX12-12FF668I
F20-XC4VFX12-12FF668I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 27 X 27 MM, 1 MM PITCH, MS-034-AAL-1, FBGA-668
27 X 27 MM, 1 MM PITCH, MS-034-AAL-1, FBGA-668

XC4VFX12-12FF668I ECAD Model


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XC4VFX12-12FF668I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of CLBs 1368
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1368 CLBS
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B668
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 668
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, MS-034-AAL-1, FBGA-668
Pin Count 668
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4VFX12-12FF668I Datasheet Download


XC4VFX12-12FF668I Overview



The chip model XC4VFX12-12FF668I is a high-performance, reliable FPGA chip developed by Xilinx, a leading provider of programmable logic solutions. It offers a wide range of features, including high-speed performance, low power consumption, and low cost. This chip is suitable for a variety of applications, including communications, high-performance computing, embedded systems, and industrial automation.


The XC4VFX12-12FF668I chip is designed for high-performance, low-power applications. It is equipped with a 12-bit wide internal memory and a 12-bit wide external memory. It also supports a wide range of I/O standards, including LVDS, LVCMOS, and SSTL. In addition, the chip has a built-in logic analyzer, which can be used to debug and troubleshoot the system.


The XC4VFX12-12FF668I chip is designed for high-performance and low-power applications. It supports a variety of technologies, including DDR3, PCIe, and Ethernet. In addition, the chip is designed to support advanced communication systems, such as 5G, Wi-Fi 6, and Bluetooth 5.0. The chip is also designed to support a wide range of operating systems, including Linux, Windows, and VxWorks.


The XC4VFX12-12FF668I chip is designed to meet the specific requirements of customers. It is designed to be compatible with a variety of development tools, such as Vivado Design Suite, Xilinx System Generator, and Xilinx SDK. In addition, the chip is designed to support a wide range of programming languages, including C, C++, Verilog, and VHDL.


The XC4VFX12-12FF668I chip is designed for a variety of applications, including high-performance computing, embedded systems, and industrial automation. It is designed to be compatible with a variety of development tools, such as Vivado Design Suite, Xilinx System Generator, and Xilinx SDK. In addition, the chip is designed to support a wide range of programming languages, including C, C++, Verilog, and VHDL.


In order to ensure the success of the XC4VFX12-12FF668I chip, it is important to consider the application environment and the specific technologies needed. It is also important to consider the original design intention of the chip and the possibility of future upgrades. Finally, it is important to consider actual case studies and precautions when designing and deploying the chip.


In conclusion, the XC4VFX12-12FF668I chip is a high-performance and reliable FPGA chip developed by Xilinx. It is designed to meet the specific requirements of customers and is suitable for a variety of applications. It supports a variety of technologies, including DDR3, PCIe, and Ethernet. In order to ensure the success of the chip, it is important to consider the application environment and the specific technologies needed, as well as the original design intention of the chip and the possibility of future upgrades.



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