AMD Xilinx
XC4VFX100-12FFG1517CS1
XC4VFX100-12FFG1517CS1 ECAD Model
XC4VFX100-12FFG1517CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 94896 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.181 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
XC4VFX100-12FFG1517CS1 Datasheet Download
XC4VFX100-12FFG1517CS1 Overview
The XC4VFX100-12FFG1517CS1 chip model is a cutting-edge technology developed by Xilinx, Inc. that has been designed to deliver superior performance and reliability for a wide range of applications. This chip model is based on the Virtex-4 family of FPGAs and is a highly advanced, high-performance FPGA that is capable of supporting a wide range of applications. It is designed to provide a high-performance solution for applications such as multimedia, networking, and embedded systems.
The XC4VFX100-12FFG1517CS1 chip model has several advantages over its competitors. It is designed to be highly efficient, allowing it to run at higher speeds and reduce power consumption. It also offers a wide range of features, including advanced memory management, enhanced system-level security, and a flexible and extensible architecture. Additionally, it is designed to be highly flexible, allowing for the addition of new features and functionality as needed.
The XC4VFX100-12FFG1517CS1 chip model is expected to be in high demand in the future due to its superior performance and reliability. It is expected to be used in a variety of applications, including multimedia, networking, and embedded systems. Additionally, it is expected to be used in the development of advanced communication systems, such as 5G and 6G systems. This chip model is also expected to be used in the development of intelligent systems, such as autonomous vehicles, smart homes, and industrial automation systems.
The XC4VFX100-12FFG1517CS1 chip model has been designed with the possibility of future upgrades in mind. It is designed to be easily upgradable, allowing for the addition of new features and functionality as needed. Additionally, it is designed to be highly scalable, allowing it to be used in both small and large networks. This chip model is also designed to be highly compatible with existing networks, making it easy to integrate into existing systems.
The XC4VFX100-12FFG1517CS1 chip model is expected to be used in a variety of applications in the future, including networks and intelligent scenarios. It is expected to be used in the development of advanced communication systems, such as 5G and 6G systems. Additionally, it is expected to be used in the development of intelligent systems, such as autonomous vehicles, smart homes, and industrial automation systems. Finally, it is expected to be used in the development of fully intelligent systems, such as the Internet of Things (IoT).
Overall, the XC4VFX100-12FFG1517CS1 chip model is a cutting-edge technology developed by Xilinx, Inc. that is designed to deliver superior performance and reliability for a wide range of applications. It is expected to be in high demand in the future due to its superior performance, reliability, and scalability. Additionally, it is designed to be easily upgradable and highly compatible with existing networks, making it an ideal choice for the development of advanced communication systems and intelligent systems. Finally, it is expected to be used in the development of fully intelligent systems, such as the Internet of Things (IoT).
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| QTY | Unit Price | Ext Price |
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