AMD Xilinx
XC4VFX100-12FFG1152CS1
XC4VFX100-12FFG1152CS1 ECAD Model
XC4VFX100-12FFG1152CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 576 | |
| Number of Outputs | 576 | |
| Number of Logic Cells | 94896 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.181 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC4VFX100-12FFG1152CS1 Datasheet Download
XC4VFX100-12FFG1152CS1 Overview
The Xilinx XC4VFX100-12FFG1152CS1 chip model is a highly advanced and versatile chip model that has been designed to meet the needs of the most demanding applications. It is a field programmable gate array (FPGA) that is based on a Virtex-4 FX100 architecture, and it has the capability to process up to 12 million system gates. This model is a perfect choice for applications that require high speed, low power consumption, and high reliability.
The XC4VFX100-12FFG1152CS1 chip model is ideal for a variety of applications, including data processing, communications, and signal processing. It is also suitable for use in embedded systems, digital signal processing (DSP) systems, and computer vision systems. It has the capability to support a wide range of technologies, including high-speed Ethernet, Gigabit Ethernet, and USB. It also supports a range of memory technologies, including DDR2 and DDR3.
The XC4VFX100-12FFG1152CS1 chip model is expected to be in high demand in the near future due to its versatility and the increasing demand for high-performance chips in a wide range of industries. This chip model is expected to be used in networks, such as 5G networks, and in intelligent systems, such as autonomous vehicles and smart building systems.
In the era of fully intelligent systems, the XC4VFX100-12FFG1152CS1 chip model is expected to play an important role. It is expected to support the development of new technologies, such as artificial intelligence (AI) and machine learning (ML), which are essential for the development of fully intelligent systems. The chip model is also expected to be used in a wide range of applications, such as facial recognition and natural language processing.
In conclusion, the XC4VFX100-12FFG1152CS1 chip model is a highly advanced and versatile chip model that is expected to be in high demand in the near future. It is expected to be used in a wide range of applications, such as networks, intelligent systems, and facial recognition. It is also expected to support the development of new technologies, such as AI and ML, which are essential for the development of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||