XC4085XLA-09BGG560I
XC4085XLA-09BGG560I
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rohs

AMD Xilinx

XC4085XLA-09BGG560I


XC4085XLA-09BGG560I
F20-XC4085XLA-09BGG560I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XC4085XLA-09BGG560I ECAD Model


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XC4085XLA-09BGG560I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 55000
Number of CLBs 3136
Combinatorial Delay of a CLB-Max 1.1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 3136 CLBS, 55000 GATES
Additional Feature CAN ALSO USE 180000 GATES
Clock Frequency-Max 227 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4085XLA-09BGG560I Datasheet Download


XC4085XLA-09BGG560I Overview



The chip model XC4085XLA-09BGG560I is an innovative piece of technology that is revolutionizing the way we think about network connectivity and intelligent scenarios. Developed by Xilinx, this model is designed to provide users with the ability to quickly and easily connect to networks, as well as to provide support for the latest technologies. It is also capable of providing support for the development and popularization of future intelligent robots.


The XC4085XLA-09BGG560I chip model is becoming increasingly popular in the industry due to its high performance, reliability, and scalability. It is capable of supporting a wide range of applications, including those related to the Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML). It is also capable of providing support for the development of fully intelligent systems, allowing users to create and deploy intelligent applications in a variety of scenarios.


The chip model is also capable of providing support for the development and popularization of future intelligent robots. This is made possible by its ability to provide support for the latest technologies, such as AI, ML, and IoT. The model also provides users with the ability to quickly and easily connect to networks, as well as to provide support for the development of intelligent applications.


In order to effectively use the XC4085XLA-09BGG560I chip model, it is important to have the right technical talents. This includes knowledge of the latest technologies, such as AI, ML, and IoT, as well as the ability to design and develop intelligent applications. It is also important to have a good understanding of the various applications that the chip model can be used for, as well as the various scenarios in which it can be applied.


In conclusion, the XC4085XLA-09BGG560I chip model is an innovative piece of technology that is revolutionizing the way we think about network connectivity and intelligent scenarios. It is capable of providing users with the ability to quickly and easily connect to networks, as well as to provide support for the development and popularization of future intelligent robots. In order to effectively use the chip model, it is important to have the right technical talents, such as knowledge of the latest technologies and the ability to design and develop intelligent applications.



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Unit Price: $316.6163
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Pricing (USD)

QTY Unit Price Ext Price
1+ $294.4532 $294.4532
10+ $291.2870 $2,912.8700
100+ $275.4562 $27,545.6181
1000+ $259.6254 $129,812.6830
10000+ $237.4622 $237,462.2250
The price is for reference only, please refer to the actual quotation!

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