AMD Xilinx
XC4085XLA-09BG560C
XC4085XLA-09BG560C ECAD Model
XC4085XLA-09BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 3136 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-09BG560C Datasheet Download
XC4085XLA-09BG560C Overview
The XC4085XLA-09BG560C is a powerful chip model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is the perfect choice for those who need to use the HDL language to develop their projects.
The XC4085XLA-09BG560C was designed with the intention of providing a reliable and efficient solution for users who need to process complex digital signals. It is also capable of being upgraded in the future to meet the demands of more advanced communication systems.
The product description of the XC4085XLA-09BG560C includes a number of features that make it an ideal choice for a variety of applications. The chip model is designed to be highly efficient and reliable, with a low power consumption that helps to keep energy costs down. It also has a wide range of I/O capabilities, allowing for easy integration into existing systems. Additionally, the chip model is designed to be highly customizable, allowing users to tailor their projects to meet their specific needs.
When it comes to designing projects with the XC4085XLA-09BG560C, it is important to pay attention to the specific design requirements. For example, the chip model is designed to be used in conjunction with the HDL language, so any projects that are created must take this into account. Additionally, users should be aware of the power requirements of their projects, as the chip model has a limited power supply. Finally, users should be aware of the specific features of the chip model and how they can be used to create their desired results.
There are a number of case studies that can be used to help understand the capabilities of the XC4085XLA-09BG560C. These case studies can provide insight into how the chip model can be used for various applications and how it can be customized to meet specific needs. Additionally, these case studies can provide users with an understanding of the precautions that need to be taken when using the chip model, such as ensuring that the correct power supply is used and that the correct HDL language is used.
Overall, the XC4085XLA-09BG560C is a powerful chip model that is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is the perfect choice for those who need to use the HDL language to develop their projects. With its range of features, low power consumption, and ability to be upgraded, the XC4085XLA-09BG560C is an ideal choice for any project. However, users should be aware of the specific design requirements and the precautions that need to be taken when using the chip model. With the right knowledge and preparation, the XC4085XLA-09BG560C can be a powerful tool for any project.
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3,883 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $435.3188 | $435.3188 |
| 10+ | $430.6379 | $4,306.3792 |
| 100+ | $407.2337 | $40,723.3689 |
| 1000+ | $383.8295 | $191,914.7270 |
| 10000+ | $351.0635 | $351,063.5250 |
| The price is for reference only, please refer to the actual quotation! | ||