AMD Xilinx
XC4085XLA-09BG352C
XC4085XLA-09BG352C ECAD Model
XC4085XLA-09BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 7448 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-09BG352C Datasheet Download
XC4085XLA-09BG352C Overview
The chip model XC4085XLA-09BG352C is a powerful and efficient semiconductor device with a wide range of applications in various industries. Manufactured by Xilinx, this chip model has been developed using the latest technology and is capable of providing high-performance computing and communication solutions. It is also capable of providing a wide range of features, including high-speed data transfer, low-power consumption, and high-resolution video capabilities.
As a result, the XC4085XLA-09BG352C chip model has become increasingly popular in the industry, and the demand for this chip model is expected to increase in the future. This is due to its ability to provide a wide range of features and capabilities for various applications. For example, the chip model can be used in communication systems, networks, and intelligent systems. It is also capable of providing low-power consumption, high-speed data transfer, and high-resolution video capabilities.
The original design intention of the XC4085XLA-09BG352C chip model was to provide a powerful and efficient solution for various applications. It is also capable of providing a wide range of features and capabilities, making it suitable for a variety of applications. Furthermore, the chip model is designed to be upgradable and can be used in advanced communication systems. This means that it can be used in the future as well, allowing for a more efficient and powerful solution.
The XC4085XLA-09BG352C chip model can be used in various networks and intelligent scenarios. It can be used to provide high-speed data transfer, low-power consumption, and high-resolution video capabilities. In addition, it can be used in the era of fully intelligent systems, allowing for more efficient and powerful solutions. This chip model can be used to provide a wide range of features, including voice recognition and machine learning capabilities.
In conclusion, the XC4085XLA-09BG352C chip model is a powerful and efficient semiconductor device with a wide range of applications in various industries. It is capable of providing a wide range of features and capabilities, making it suitable for a variety of applications. Furthermore, it is designed to be upgradable and can be used in advanced communication systems. This chip model can be used in various networks and intelligent scenarios, and can be used in the era of fully intelligent systems. As a result, the demand for this chip model is expected to increase in the future.
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5,817 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $320.3099 | $320.3099 |
| 10+ | $316.8657 | $3,168.6566 |
| 100+ | $299.6447 | $29,964.4704 |
| 1000+ | $282.4237 | $141,211.8720 |
| 10000+ | $258.3144 | $258,314.4000 |
| The price is for reference only, please refer to the actual quotation! | ||