AMD Xilinx
XC4085XLA-08HQ240C
XC4085XLA-08HQ240C ECAD Model
XC4085XLA-08HQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 3136 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-08HQ240C Datasheet Download
XC4085XLA-08HQ240C Overview
The chip model XC4085XLA-08HQ240C is an advanced integrated circuit (IC) developed by Xilinx, Inc. It is a high-performance, low-power, low-cost programmable logic device (PLD) with a wide range of applications. It is suitable for use in embedded systems, consumer electronics, automotive, industrial, and medical applications.
The XC4085XLA-08HQ240C chip model is designed to provide high-speed, low-power operation and is optimized for use in advanced communication systems. It features a single-cycle 10-bit counter and a versatile 32-bit multiplier, making it ideal for applications requiring high-speed data processing. Additionally, the device supports a wide range of I/O voltage levels, allowing it to be used in a variety of applications.
The XC4085XLA-08HQ240C chip model is designed to meet the needs of both the consumer and industrial markets. It is designed to be highly reliable and cost-effective, with a wide range of features and performance capabilities. It is also designed to be flexible and easy to use, with a wide range of programming options. Additionally, the device is designed to be highly efficient and power-efficient, allowing it to be used in a variety of applications.
The XC4085XLA-08HQ240C chip model is also designed to be highly scalable, allowing it to be used in a variety of applications. It is designed to be highly compatible with a variety of communication protocols and can be used in a variety of applications. Additionally, the device is designed to be highly secure, with a wide range of security features.
The XC4085XLA-08HQ240C chip model is also designed to be highly reliable and cost-effective. It is designed to meet the needs of both the consumer and industrial markets and is designed to be highly reliable and cost-effective. Additionally, the device is designed to be highly compatible with a variety of communication protocols and can be used in a variety of applications.
In terms of industry trends, the XC4085XLA-08HQ240C chip model is designed to be highly reliable and cost-effective. It is designed to meet the needs of both the consumer and industrial markets and is designed to be highly reliable and cost-effective. Additionally, the device is designed to be highly compatible with a variety of communication protocols and can be used in a variety of applications. As such, it is expected that the XC4085XLA-08HQ240C chip model will remain popular in the future and will continue to be used in a variety of applications.
In terms of future development, the XC4085XLA-08HQ240C chip model is designed to be highly reliable and cost-effective. It is designed to meet the needs of both the consumer and industrial markets and is designed to be highly reliable and cost-effective. Additionally, the device is designed to be highly compatible with a variety of communication protocols and can be used in a variety of applications. As such, it is expected that the XC4085XLA-08HQ240C chip model will remain popular in the future and will continue to be used in a variety of applications.
In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. The XC4085XLA-08HQ240C chip model is designed to be highly reliable and cost-effective and is designed to meet the needs of both the consumer and industrial markets. Additionally, the device is designed to be highly compatible with a variety of communication protocols and can be used in a variety of applications. As such, it is expected that the XC4085XLA-08HQ240C chip model will remain popular in the future and will continue to be used in a variety of applications.
In conclusion, the XC4085XLA-08HQ240C chip model is an advanced integrated circuit (IC) developed by Xilinx, Inc. It is designed to provide high-speed, low-power operation and is optimized for use in advanced communication systems. It is designed to be highly reliable and cost-effective, with a wide range of features and performance capabilities. Additionally, the device is designed to be highly compatible with a variety of communication protocols and can be used in a variety of applications. As such, it is expected that the XC4085XLA-08HQ240C chip model will remain popular in the future and will continue to be used in a variety of applications. It is also important to note that the application environment may require the support of new technologies, depending on what specific technologies are needed.
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