AMD Xilinx
XC4085XLA-08BG560I
XC4085XLA-08BG560I ECAD Model
XC4085XLA-08BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 3136 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-08BG560I Datasheet Download
XC4085XLA-08BG560I Overview
The XC4085XLA-08BG560I chip model is a cutting-edge semiconductor device designed and manufactured by Xilinx. It is a high-performance, low-power, cost-effective FPGA (Field Programmable Gate Array) solution that is suitable for a wide range of applications. With its advanced features and powerful capabilities, the XC4085XLA-08BG560I chip model has quickly become a popular choice for many industries.
The XC4085XLA-08BG560I chip model offers a wide range of features and capabilities that make it an ideal solution for a variety of applications. It is designed to provide a high-performance solution with a low power consumption and cost-effectiveness. The chip model is also equipped with a powerful embedded processor, which makes it suitable for a wide range of applications. Additionally, the chip model also supports a variety of advanced technologies, such as Ethernet, USB, and PCI Express, which make it suitable for a wide range of applications.
The XC4085XLA-08BG560I chip model has been designed to be highly flexible and customizable. It can be used in a variety of applications, including communications, industrial automation, automotive, medical, and consumer electronics. It is also suitable for a wide range of applications in the aerospace and defense industries. The chip model is also designed to be compatible with a wide range of operating systems, including Linux, Windows, and VxWorks.
In terms of future industry trends, the XC4085XLA-08BG560I chip model is expected to remain in high demand in the coming years. As the demand for advanced technologies continues to grow, the XC4085XLA-08BG560I chip model is likely to remain a popular choice for many industries. Additionally, the chip model is expected to remain competitive in terms of cost, power consumption, and performance.
When it comes to application environments that require the support of new technologies, the XC4085XLA-08BG560I chip model is a great choice. It is designed to be compatible with a wide range of operating systems and technologies, making it a great choice for many applications. Additionally, the chip model is designed to be highly customizable, allowing it to be tailored to the specific needs of an application.
In order to fully understand the capabilities of the XC4085XLA-08BG560I chip model, it is important to understand the product description and specific design requirements. Additionally, it is important to understand the actual case studies and precautions that need to be taken when using the chip model. By understanding the product description and design requirements, as well as the actual case studies and precautions, it is possible to gain a better understanding of the capabilities of the XC4085XLA-08BG560I chip model and determine if it is the right choice for an application.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||